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Electronics engineering

Results 6961 - 6980 of 8409

Electronics engineering

Hardcover. This book address the practical issues associated with the development of nanomaterial-based devices in applications areas such as solar cells, luminous devices for optical communication, and high mobility transistors. Editor(s): Wang, Zhiming M.; Wu, Jiang; Li, Handong. Series: Springer Series in Materials Science. Num Pages: 421 pages, 101 black & white illustrations, 178 colour illustrations, 14 black & white tables, biogr. BIC Classification: TBN; TDPB; TJFD; TTB. Category: (P) Professional & Vocational. Dimension: 242 x 164 x 28. Weight in Grams: 768.
Format
Hardback
Publication date
2013
Publisher
Springer
Edition
2013th Edition
Number of pages
450
Condition
New
SKU
V9781461481683
ISBN
9781461481683
Hardback
Condition: New

€ 182.72

Hardback. Presents a study of silicon-based distributed architectures in wideband circuits. This title describes novel circuit architectures for ultra-wideband (UWB) wireless technologies. It begins with an introduction of several transceiver architectures for UWB. It focuses on RF front-end of the UWB radio. Series: Analog Circuits and Signal Processing. Num Pages: 105 pages, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 7. Weight in Grams: 332.
Format
Hardback
Publication date
2008
Publisher
Springer-Verlag New York Inc. United States
Number of pages
105
Condition
New
SKU
V9781402067211
ISBN
9781402067211
Hardback
Condition: New

€ 120.84

Paperback. Editor(s): Furukawa, S. Series: Advances in Solid State Technology (Closed). Num Pages: 308 pages, biography. BIC Classification: PHFC; TGM; TJF. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 16. Weight in Grams: 474.
Format
Paperback
Publication date
2011
Publisher
Springer Netherlands
Edition
Softcover reprint of the original 1st ed. 1985
Number of pages
308
Condition
New
SKU
V9789401088466
ISBN
9789401088466
Paperback
Condition: New

€ 62.64

Hardback. Describes the different facets of Silicon-on-Insulator (SOI) technology. This title reviews SOI materials, devices and circuits. It discusses SOI fabrication and characterization techniques, SOI device processing, the physics of the SOI MOSFET as well as that of SOI other devices, and the performances of SOI circuits. Num Pages: 272 pages, biography. BIC Classification: TJFD5. Category: (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 17. Weight in Grams: 581.
Format
Hardback
Publication date
1997
Publisher
Kluwer Academic Publishers United States
Edition
2 Rev ed
Number of pages
272
Condition
New
SKU
V9780792380078
ISBN
9780792380078
Hardback
Condition: New

€ 186.01

Hardback. Explains the principles and the physics of SOI materials fabrication and characterization, SOI processing SOI MOSFET device physics, and the use of SOI material in novel device design. The performances of SOI circuits for VLSI/ULSI and for niche applications are also described. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 228 pages, biography. BIC Classification: TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 14. Weight in Grams: 520.
Format
Hardback
Publication date
1991
Publisher
Kluwer Academic Publishers United States
Number of pages
228
Condition
New
SKU
V9780792391500
ISBN
9780792391500
Hardback
Condition: New

€ 123.14

paperback. Num Pages: 366 pages, biography. BIC Classification: PNR; THR; TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 20. Weight in Grams: 587.
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Edition
3rd Edition
Number of pages
366
Condition
New
SKU
V9781461347958
ISBN
9781461347958
Paperback
Condition: New

€ 181.68

paperback. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 228 pages, biography. BIC Classification: THR; TJFC; TJFD. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 13. Weight in Grams: 379.
Format
Paperback
Publication date
2013
Publisher
Springer United States
Edition
Softcover reprint of the original 1st ed. 1991
Number of pages
228
Condition
New
SKU
V9781475721232
ISBN
9781475721232
Paperback
Condition: New

€ 119.17

Hardcover. Composite Insulators for Electric Power Networks provides an overview of composite insulators for power transmission. The text serves as a guide for readers on topics like material selection, properties and design, applications, and the recycling of these composite materials. Series: Power Systems. Num Pages: 495 pages, biography. BIC Classification: TDCQ; TGP; THRD; TJFD. Category: (P) Professional & Vocational. Dimension: 240 x 163 x 33. Weight in Grams: 930.
Format
Hardback
Publication date
2012
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Edition
2013th Edition
Number of pages
250
Condition
New
SKU
V9783642153198
ISBN
9783642153198
Hardback
Condition: New

€ 183.41

Hardback. Can psychoanalysis offer a new computer model? In seeking to answer such questions, this book is the first to fully address the disparate languages between computer scientists and neuro-psychologists in the common field of artificial intelligence. Editor(s): Dietrich, Dietmar; Fodor, Georg; Zucker, Gerhard; Bruckner, Dietmar. Num Pages: 436 pages, 63 black & white illustrations, biography. BIC Classification: JMAF; JMM; JMR; TJFM1; UYQ; UYZ. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 25. Weight in Grams: 813.
Format
Hardback
Publication date
2008
Publisher
Springer Verlag GmbH Austria
Number of pages
436
Condition
New
SKU
V9783211094501
ISBN
9783211094501
Hardback
Condition: New

€ 182.84

Paperback. Can psychoanalysis offer a new computer model? In seeking to answer such questions, this book is the first to fully address the disparate languages between computer scientists and neuro-psychologists in the common field of artificial intelligence. Editor(s): Dietrich, Dietmar; Fodor, Georg; Zucker, Gerhard; Bruckner, Dietmar. Num Pages: 436 pages, 63 black & white illustrations, biography. BIC Classification: JMAF; JMM; JMR; TJFM; UYQ; UYZ. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 23. Weight in Grams: 635.
Format
Paperback
Publication date
2010
Publisher
Springer Verlag GmbH Austria
Edition
1st ed. Softcover of orig. ed. 2009
Number of pages
436
Condition
New
SKU
V9783211998694
ISBN
9783211998694
Paperback
Condition: New

€ 182.52

Paperback. This book offers a broad discussion of recent developments in simulation, modeling and verification of integrated circuits and biological systems. Coverage include industrial practice of fast SPICE simulation, large scale parallel circuit simulation, and more. Editor(s): Li, Peng; Silveira, Luis Miguel; Feldmann, Peter. Num Pages: 213 pages, 30 black & white tables, biography. BIC Classification: TDPB; TJFC; UGK. Category: (G) General (US: Trade). Dimension: 235 x 155 x 12. Weight in Grams: 338.
Format
Paperback
Publication date
2014
Publisher
Springer Netherlands
Number of pages
213
Condition
New
SKU
V9789400790223
ISBN
9789400790223
Paperback
Condition: New

€ 118.83

Paperback / so. Series: Isw Forschung Und Praxis. Num Pages: black & white illustrations, bibliography. BIC Classification: TBC; TD; TJFM1; UMZ. Category: (G) General (US: Trade). Dimension: 210 x 148 x 7. Weight in Grams: 172.
Format
Paperback
Publication date
1984
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Condition
New
SKU
V9783540131397
ISBN
9783540131397
Paperback
Condition: New

€ 66.25

Paperback. Editor(s): Feldmann, Klaus; Schmidt, Bernd. Series: Fachberichte Simulation. Num Pages: 459 pages, 57 black & white illustrations. BIC Classification: TBC; TBJ; TJFM; UMZ. Category: (P) Professional & Vocational. Dimension: 244 x 170 x 24. Weight in Grams: 760.
Format
Paperback
Publication date
1988
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Number of pages
459
Condition
New
SKU
V9783540502500
ISBN
9783540502500
Paperback
Condition: New

€ 80.29

Paperback. Editor(s): Fasol, Karl H.; Diekmann, Klaus. Series: Fachberichte Simulation. Num Pages: 507 pages, 6 black & white illustrations. BIC Classification: PHU; PN; TJFM; UGK; UMZ; UYQ. Category: (P) Professional & Vocational. Dimension: 244 x 170 x 26. Weight in Grams: 870.
Format
Paperback
Publication date
1990
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Number of pages
507
Condition
New
SKU
V9783540529422
ISBN
9783540529422
Paperback
Condition: New

€ 80.77

Paperback. Series: SpringerBriefs in Physics. Num Pages: 113 pages, 10 black & white illustrations, 28 colour illustrations, biography. BIC Classification: TJF; TTB. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 6. Weight in Grams: 191.
Format
Paperback
Publication date
2015
Publisher
Springer International Publishing AG Switzerland
Number of pages
113
Condition
New
SKU
V9783319154848
ISBN
9783319154848
Paperback
Condition: New

€ 71.34

Paperback. Editor(s): Ryssel, Heiner; Pichler, Peter. Num Pages: 501 pages, biography. BIC Classification: TJF; UGC; UGK. Category: (P) Professional & Vocational. Dimension: 244 x 170 x 27. Weight in Grams: 886.
Format
Paperback
Publication date
2012
Publisher
Springer Verlag GmbH Austria
Edition
Softcover reprint of the original 1st ed. 1995
Number of pages
501
Condition
New
SKU
V9783709173633
ISBN
9783709173633
Paperback
Condition: New

€ 65.22

Paperback. Editor(s): Selberherr, Siegfried; Stippel, Hannes; Strasser, Ernst. Num Pages: 507 pages, biography. BIC Classification: PH; THR; TJFD5. Category: (P) Professional & Vocational. Dimension: 244 x 170 x 27. Weight in Grams: 906.
Format
Paperback
Publication date
2012
Publisher
Springer Verlag GmbH Austria
Edition
Softcover reprint of the original 1st ed. 1993
Number of pages
507
Condition
New
SKU
V9783709173725
ISBN
9783709173725
Paperback
Condition: New

€ 65.33

Paperback. Contains the proceedings of the 12th edition of the International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2007, held September 2007 in Austria. This volume provides a forum for the presentation of developments in the theoretical description and numerical simulation of semiconductor fabrication processes. Editor(s): Grasser, Tibor (Technical University of Vienna, Austria); Selberherr, Siegfried. Num Pages: 463 pages, biography. BIC Classification: TJFD5. Category: (UP) Postgraduate, Research & Scholarly. Dimension: 244 x 170 x 24. Weight in Grams: 759.
Format
Paperback
Publication date
2007
Publisher
Springer Verlag GmbH Austria
Number of pages
463
Condition
New
SKU
V9783211728604
ISBN
9783211728604
Paperback
Condition: New

€ 184.43

Paperback. Editor(s): Tsoukalas, Dimitris; Tsamis, Christos. Num Pages: 455 pages, biography. BIC Classification: TBN; TGM; TJF. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 24. Weight in Grams: 714.
Format
Paperback
Publication date
2012
Publisher
Springer Verlag GmbH Austria
Edition
Softcover reprint of the original 1st ed. 2001
Number of pages
455
Condition
New
SKU
V9783709172780
ISBN
9783709172780
Paperback
Condition: New

€ 233.99

paperback. Editor(s): Meyer, Kristin De; Biesemans, Serge. Num Pages: 410 pages, biography. BIC Classification: TJFD5. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 22. Weight in Grams: 652.
Format
Paperback
Publication date
2012
Publisher
Springer Verlag GmbH Austria
Edition
Softcover reprint of the original 1st ed. 1998
Number of pages
410
Condition
New
SKU
V9783709174159
ISBN
9783709174159
Paperback
Condition: New

€ 233.54

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