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Interconnects in VLSI Design
Hartmut . Ed(S): Grabinski
€ 180.86
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Description for Interconnects in VLSI Design
Paperback. Editor(s): Grabinski, Hartmut. Num Pages: 236 pages, biography. BIC Classification: THR; TJFC; UGC. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 13. Weight in Grams: 385.
This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement ... Read more
This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement ... Read more
Product Details
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Number of pages
236
Condition
New
Number of Pages
236
Place of Publication
New York, NY, United States
ISBN
9781461369547
SKU
V9781461369547
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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