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. Ed(S): Grasser, Tibor (Technical University Of Vienna, Austria); Selberherr, Siegfried - Simulation of Semiconductor Processes and Devices - 9783211728604 - V9783211728604
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Simulation of Semiconductor Processes and Devices

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Description for Simulation of Semiconductor Processes and Devices Paperback. Contains the proceedings of the 12th edition of the International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2007, held September 2007 in Austria. This volume provides a forum for the presentation of developments in the theoretical description and numerical simulation of semiconductor fabrication processes. Editor(s): Grasser, Tibor (Technical University of Vienna, Austria); Selberherr, Siegfried. Num Pages: 463 pages, biography. BIC Classification: TJFD5. Category: (UP) Postgraduate, Research & Scholarly. Dimension: 244 x 170 x 24. Weight in Grams: 759.
The "Twelfth International Conference on Simulation of Semiconductor Processes and Devices" (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presenta­ tion and discussion of outstanding recent advances and developments in the field of numerical process and ... Read more

Product Details

Format
Paperback
Publication date
2007
Publisher
Springer Verlag GmbH Austria
Number of pages
463
Condition
New
Number of Pages
463
Place of Publication
Vienna, Austria
ISBN
9783211728604
SKU
V9783211728604
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15

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