×


 x 

Shopping cart
. Ed(S): Lee, Y. C.; Chen, W.T.; Chen, W.T. - Manufacturing Challenges in Electronic Packaging - 9780412620300 - V9780412620300
Stock image for illustration purposes only - book cover, edition or condition may vary.

Manufacturing Challenges in Electronic Packaging

€ 127.86
FREE Delivery in Ireland
Description for Manufacturing Challenges in Electronic Packaging hardcover. Addresses both advanced packaging and manufacturing activities, enhanced by reviews and analysis. This book is useful as a reference for professionals who need to meet the goal of manufacturing with only one defective package in a million escaping undetected. Editor(s): Lee, Y. C.; Chen, W.T.; Chen, W.T. Num Pages: 261 pages, biography. BIC Classification: TD; TJF. Category: (P) Professional & Vocational. Dimension: 234 x 155 x 17. Weight in Grams: 565.
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal­ lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take ... Read more

Product Details

Format
Hardback
Publication date
1997
Publisher
Chapman and Hall United Kingdom
Number of pages
261
Condition
New
Number of Pages
261
Place of Publication
London, United Kingdom
ISBN
9780412620300
SKU
V9780412620300
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15

Reviews for Manufacturing Challenges in Electronic Packaging

Goodreads reviews for Manufacturing Challenges in Electronic Packaging


Subscribe to our newsletter

News on special offers, signed editions & more!