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Thermal Testing of Integrated Circuits
Altet, Josep; Rubio, Antonio
€ 123.46
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Description for Thermal Testing of Integrated Circuits
Paperback. Num Pages: 204 pages, 102 black & white illustrations, biography. BIC Classification: TDP; TJFC. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 12. Weight in Grams: 349.
Integrated circuits (IC's) have undergone a significant evolution in terms of complexity and performance as a result 'of the substantial advances made in manufacturing technology. Circuits, in their various mixed formats, can be made up tens or even hundreds of millions of devices. They work at extremely low voltages and switch at very high frequencies. Testing of circuits has become an essential process in IC manufacturing, in the effort to ensure that the manufactured components have the appropriate levels of quality. Along with the ongoing trend towards more advanced technology and circuit features, major testing challenges are continuously emerging. The ... Read more
Integrated circuits (IC's) have undergone a significant evolution in terms of complexity and performance as a result 'of the substantial advances made in manufacturing technology. Circuits, in their various mixed formats, can be made up tens or even hundreds of millions of devices. They work at extremely low voltages and switch at very high frequencies. Testing of circuits has become an essential process in IC manufacturing, in the effort to ensure that the manufactured components have the appropriate levels of quality. Along with the ongoing trend towards more advanced technology and circuit features, major testing challenges are continuously emerging. The ... Read more
Product Details
Format
Paperback
Publication date
2011
Publisher
Springer-Verlag New York Inc. United States
Number of pages
204
Condition
New
Number of Pages
204
Place of Publication
New York, NY, United States
ISBN
9781441952875
SKU
V9781441952875
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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