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3-Dimensional Process Simulation
J. . Ed(S): Lorenz
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Description for 3-Dimensional Process Simulation
Paperback. Editor(s): Lorenz, J. Num Pages: 196 pages, biography. BIC Classification: TJF; UGC; UGK. Category: (P) Professional & Vocational. Dimension: 244 x 170 x 11. Weight in Grams: 374.
Whereas two-dimensional semiconductor process simulation has achieved a certain degree of maturity, three-dimensional process simulation is a newly emerging field in which most efforts are dedicated to necessary basic developments. Research in this area is promoted by the growing demand to obtain reliable information on device geometries and dopant distributions needed for three-dimensional device simulation, and challenged by the great algorithmic problems caused by moving interfaces and by the requirement to limit computation times and memory requirements. A workshop (Erlangen, September 5, 1995) provided a forum to discuss the industrial needs, technical problems, and solutions being developed in the field ... Read more
Whereas two-dimensional semiconductor process simulation has achieved a certain degree of maturity, three-dimensional process simulation is a newly emerging field in which most efforts are dedicated to necessary basic developments. Research in this area is promoted by the growing demand to obtain reliable information on device geometries and dopant distributions needed for three-dimensional device simulation, and challenged by the great algorithmic problems caused by moving interfaces and by the requirement to limit computation times and memory requirements. A workshop (Erlangen, September 5, 1995) provided a forum to discuss the industrial needs, technical problems, and solutions being developed in the field ... Read more
Product Details
Format
Paperback
Publication date
2011
Publisher
Springer Verlag GmbH Austria
Number of pages
196
Condition
New
Number of Pages
196
Place of Publication
Vienna, Austria
ISBN
9783709174302
SKU
V9783709174302
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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