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Advanced Materials for Thermal Management of Electronic Packaging
Tong, Xingcun Colin, Ph.D.
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Description for Advanced Materials for Thermal Management of Electronic Packaging
Hardback. This book offers a comprehensive approach to advanced thermal management in electronic packaging, including the fundamentals of heat transfer, component design guidelines, materials selection, cooling, characterization, processing and manufacturing and more. Series: Springer Series in Advanced Microelectronics. Num Pages: 640 pages, 26 black & white tables, biography. BIC Classification: TGMB; TJFC; TJFD. Category: (P) Professional & Vocational. Dimension: 242 x 159 x 53. Weight in Grams: 1102.
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials ... Read more
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials ... Read more
Product Details
Format
Hardback
Publication date
2011
Publisher
Springer-Verlag New York Inc. United States
Number of pages
640
Condition
New
Series
Springer Series in Advanced Microelectronics
Number of Pages
618
Place of Publication
New York, NY, United States
ISBN
9781441977588
SKU
V9781441977588
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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