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Silicon Carbide Microsystems for Harsh Environments
Wijesundara, Muthu; Azevedo, Robert G.
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Description for Silicon Carbide Microsystems for Harsh Environments
Paperback. This book reviews state-of-the-art Silicon Carbide (SiC) technologies. It includes reviews of MEMS devices and provides a framework for the joining of electronics and MEMS along with packaging into usable harsh-environment-ready sensor modules. Series: MEMS Reference Shelf. Num Pages: 248 pages, biography. BIC Classification: TDM; TJF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 14. Weight in Grams: 385.
Silicon Carbide Microsystems for Harsh Environments reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments, technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation. The authors use the SiC technology platform suite the model platform for developing harsh environment microsystems and then detail the current status of the specific individual technologies (electronics, MEMS, packaging). Additionally, methods towards system level integration of components and key challenges are evaluated and discussed based on the current state of SiC materials processing and device ... Read more
Silicon Carbide Microsystems for Harsh Environments reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments, technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation. The authors use the SiC technology platform suite the model platform for developing harsh environment microsystems and then detail the current status of the specific individual technologies (electronics, MEMS, packaging). Additionally, methods towards system level integration of components and key challenges are evaluated and discussed based on the current state of SiC materials processing and device ... Read more
Product Details
Format
Paperback
Publication date
2013
Publisher
Springer-Verlag New York Inc. United States
Number of pages
248
Condition
New
Series
MEMS Reference Shelf
Number of Pages
232
Place of Publication
New York, NY, United States
ISBN
9781461428824
SKU
V9781461428824
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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