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11%OFFLian-Tuu Yeh - Thermal Management of Microelectronic Equipment Heat Transfer Theory Analysis Methods, and Design Practices, 2nd edition - 9780791861097 - V9780791861097
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Thermal Management of Microelectronic Equipment Heat Transfer Theory Analysis Methods, and Design Practices, 2nd edition

€ 158.75
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Description for Thermal Management of Microelectronic Equipment Heat Transfer Theory Analysis Methods, and Design Practices, 2nd edition hardcover. This second edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advances in the component technology of microelectronics. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. Series Editor(s): Agonafer, D. Series: Electronic Packaging. Num Pages: 500 pages, black & white illustrations. BIC Classification: TJF. Category: (G) General (US: Trade). Dimension: 229 x 152 x 29. Weight in Grams: 866.
This Second Edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advancements in the component technology of microelectronics. The most noticeable one is the addition of an entirely new chapter on microwave modules and the gallium arsenide (GaAs) chips, which have seldom been discussed in any of the textbooks or publications in the area of thermal management of electronic equipment. With this new chapter, the book is complete and whole in the area of thermal design of electronics systems.

With an increased demand on system reliability and performance combined with the miniaturization ... Read more

Product Details

Format
Hardback
Publication date
2016
Publisher
American Society of Mechanical Engineers United States
Number of pages
500
Condition
New
Series
Electronic Packaging
Number of Pages
500
Place of Publication
Fairfield, United States
ISBN
9780791861097
SKU
V9780791861097
Shipping Time
Usually ships in 5 to 9 working days
Ref
99-3

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