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Solder Joint Reliability
John H. Lau
€ 245.62
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Description for Solder Joint Reliability
Paperback. Num Pages: 631 pages, 146 black & white illustrations, biography. BIC Classification: TGXT; THR; TJFC; UMB. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 34. Weight in Grams: 991.
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided ... Read more
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided ... Read more
Product Details
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
631
Condition
New
Number of Pages
631
Place of Publication
New York, NY, United States
ISBN
9781461367437
SKU
V9781461367437
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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