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. Ed(S): Chai, D.; Cook, Wade D. (York University, Toronto, Canada); Zhu, Joe - Data Envelopment Analysis - 9781489980670 - V9781489980670
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Data Envelopment Analysis

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Description for Data Envelopment Analysis hardcover. Data Envelopment Analysis Editor(s): Chai, D.; Cook, Wade D. (York University, Toronto, Canada); Zhu, Joe. Series: International Series in Operations Research & Management Science. Num Pages: 611 pages, 68 black & white illustrations, 41 colour illustrations, 93 black & white tables, biograp. BIC Classification: KJT; TGP. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 38. Weight in Grams: 1167.

This handbook serves as a complement to the Handbook on Data Envelopment Analysis (eds, W.W. Cooper, L.M. Seiford and J, Zhu, 2011, Springer) in an effort to extend the frontier of DEA research. It provides a comprehensive source for the state-of-the art DEA modeling on internal structures and network DEA. Chapter 1 provides a survey on two-stage network performance decomposition and modeling techniques. Chapter 2 discusses the pitfalls in network DEA modeling. Chapter 3 discusses efficiency decompositions in network DEA under three types of structures, namely series, parallel and dynamic. Chapter 4 studies the determination of the network DEA frontier. ... Read more

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Product Details

Format
Hardback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
611
Condition
New
Series
International Series in Operations Research & Management Science
Number of Pages
599
Place of Publication
New York, United States
ISBN
9781489980670
SKU
V9781489980670
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15

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