Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Michael Pecht
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Description for Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Hardcover. All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost--effective products should know that the paradigm has shifted. Editor(s): Pecht, Michael; Dasgupta, Abhijit; Evans, John W.; Evans, Jillian Y. Num Pages: 462 pages, Illustrations. BIC Classification: KJMV5; TGPQ; TGPR; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 243 x 163 x 29. Weight in Grams: 888.
All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests.
This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful...
* ... Read more
All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests.
This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful...
* ... Read more
Product Details
Format
Hardback
Publication date
1994
Publisher
John Wiley and Sons Ltd United States
Number of pages
462
Condition
New
Number of Pages
496
Place of Publication
, United States
ISBN
9780471594369
SKU
V9780471594369
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
About Michael Pecht
DR. MICHAEL PECHT is a ten-ured faculty member with a jointappointment in Systems Research and Mechanical Engineering, and theDirector of the CALCE Electronic Packag-ing Research Center at theUniversity of Maryland. He has an MS in electrical engineering andan MS and PhD in engineering mechanics from the University ofWisconsin. He is a Professional Engineer and an IEEE Fellow. Heserves on the ... Read more
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