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Advanced Wire Bond Interconnection Technology
Shankara K. Prasad
€ 375.30
FREE Delivery in Ireland
Description for Advanced Wire Bond Interconnection Technology
Mixed media pr. Addresses wire bonding from both manufacturing and reliability perspectives. This book explains how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor. Num Pages: 669 pages, biography. BIC Classification: UT. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 38. Weight in Grams: 1155.
Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to ... Read more
Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to ... Read more
Product Details
Publication date
2004
Publisher
Springer-Verlag New York Inc. United States
Number of pages
669
Condition
New
Number of Pages
669
Format
Multiple-component retail product
Place of Publication
New York, NY, United States
ISBN
9781402077623
SKU
V9781402077623
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
Reviews for Advanced Wire Bond Interconnection Technology
From the reviews: "...intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers... This book has excellent overall tutorial and enough description of wire and bonding equipment... If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the ... Read more