Stock image for illustration purposes only - book cover, edition or condition may vary.
Arbitrary Modeling of Tsvs for 3D Integrated Circuits
Salah, Khaled; El-Rouby, Alaa
€ 118.03
FREE Delivery in Ireland
Description for Arbitrary Modeling of Tsvs for 3D Integrated Circuits
Paperback. Series: Analog Circuits and Signal Processing. Num Pages: 188 pages, 60 black & white illustrations, 99 colour illustrations, 58 black & white tables, 5 colou. BIC Classification: TJF; TJFC; UYF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 10. Weight in Grams: 302.
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Product Details
Format
Paperback
Publication date
2016
Publisher
Springer International Publishing AG Switzerland
Number of pages
188
Condition
New
Series
Analog Circuits and Signal Processing
Number of Pages
179
Place of Publication
Cham, Switzerland
ISBN
9783319374970
SKU
V9783319374970
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
Reviews for Arbitrary Modeling of Tsvs for 3D Integrated Circuits