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John H. . Ed(S): Lau - Handbook of Tape Automated Bonding - 9780442004279 - V9780442004279
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Handbook of Tape Automated Bonding

€ 253.69
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Description for Handbook of Tape Automated Bonding Hardback. A guide to the TAB technology - including TAB tape, bump, inner lead bonding, encapsulation, testing, burn-in, outer lead bonding, inspection, rework, thermal management and reliability. It is suitable for professionals active in TAB research and development and those who wish to master TAB problem solving methods. Editor(s): Lau, John H. Num Pages: 670 pages, biography. BIC Classification: UM. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 234 x 156 x 36. Weight in Grams: 1116.
Handbook of tape automated bonding (TAB) is a one-stop guide to the state of the art of TAB technology - including TAB tape, bump, inner lead bonding, encapsulation, testing, burn-in, outer lead bonding, inspection, rework, thermal management and reliability. For professionals active in TAB research and development, those who wish to master TAB problem solving methods, and those who must choose a high-performance and cost-effective packaging technique for their interconnect systems, here's a timely summary of progress in all aspects of this fascinating field.

Product Details

Format
Hardback
Publication date
1992
Publisher
Kluwer Academic Publishers Group Netherlands
Number of pages
670
Condition
New
Number of Pages
646
Place of Publication
, United States
ISBN
9780442004279
SKU
V9780442004279
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15

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