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Kieran . Ed(S): Delaney - Ambient Intelligence with Microsystems - 9780387462639 - V9780387462639
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Ambient Intelligence with Microsystems

€ 202.48
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Description for Ambient Intelligence with Microsystems Hardback. Investigates the issues required to ensure technology platforms capable of being seamlessly integrated into everyday objects. This title deals with the requirements for integrated computation and MEMs sensors, system-in-a-package solutions, and multi-chip modules. Editor(s): Delaney, Kieran. Series: Microsystems. Num Pages: 422 pages, 9 black & white tables, biography. BIC Classification: UYQ. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 23. Weight in Grams: 1730.

Augmented Materials and Smart Objects investigates the issues required to ensure technology platforms capable of being seamlessly integrated into everyday objects, particularly the requirements for integrated computation and MEMs sensors, System-in-a-package solutions, multi-chip modules, the impact of the trend towards embedded microelectronic electronics sub-systems, novel assembly techniques for autonomous MEMs sensors, as well as practical performance issues that are key to the AmI concept.

Also discussed are current requirements for realizing applications-oriented examples of smart objects (e.g. smart textiles, gadgets, integration of smart systems for utility and environmental monitoring, etc); these are based upon heterogeneous systems linking networks of sensors ... Read more

Finally, Augmented Materials and Smart Objects describes and discusses a number of vision statements strongly relevant to the future development of distributed embedded sensor and actuator platforms for smart objects, and ultimately Ambient Intelligence. The framework for this is the concept of Augmented Materials; these are materials with fully embedded distributed information systems, designed to measure all relevant physical properties and provide a full knowledge representation of the material; in effect, the material would "know" itself, and its current status.

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Product Details

Format
Hardback
Publication date
2008
Publisher
Springer-Verlag New York Inc. United States
Number of pages
422
Condition
New
Series
Microsystems
Number of Pages
422
Place of Publication
New York, NY, United States
ISBN
9780387462639
SKU
V9780387462639
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15

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