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Coupled Data Communication Techniques for High-Performance and Low-Power Computing
. Ed(S): Ho, Ron; Drost, Robert
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Description for Coupled Data Communication Techniques for High-Performance and Low-Power Computing
Hardback. This overview of the circuits, architectures, and chip packaging for coupled data techniques discusses current research in chip-to-board capacitive coupling, chip-to-chip capacitive coupling, chip-to-chip inductive coupling, and chip-to-chip optical coupling. Editor(s): Ho, Ron; Drost, Robert. Series: Integrated Circuits and Systems. Num Pages: 206 pages, 183 black & white illustrations, biography. BIC Classification: TJFC; UKP. Category: (P) Professional & Vocational. Dimension: 241 x 163 x 20. Weight in Grams: 498.
Wafer-scale integration has long been the dream of system designers. Instead of chopping a wafer into a few hundred or a few thousand chips, one would just connect the circuits on the entire wafer. What an enormous capability wafer-scale integration would offer: all those millions of circuits connected by high-speed on-chip wires. Unfortunately, the best known optical systems can provide suitably ?ne resolution only over an area much smaller than a whole wafer. There is no known way to pattern a whole wafer with transistors and wires small enough for modern circuits. Statistical defects present a ?rmer barrier to wafer-scale ... Read more
Wafer-scale integration has long been the dream of system designers. Instead of chopping a wafer into a few hundred or a few thousand chips, one would just connect the circuits on the entire wafer. What an enormous capability wafer-scale integration would offer: all those millions of circuits connected by high-speed on-chip wires. Unfortunately, the best known optical systems can provide suitably ?ne resolution only over an area much smaller than a whole wafer. There is no known way to pattern a whole wafer with transistors and wires small enough for modern circuits. Statistical defects present a ?rmer barrier to wafer-scale ... Read more
Product Details
Format
Hardback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Number of pages
206
Condition
New
Series
Integrated Circuits and Systems
Number of Pages
206
Place of Publication
New York, NY, United States
ISBN
9781441965875
SKU
V9781441965875
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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