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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Sung Kyu Lim
€ 141.25
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Description for Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Paperback. This book describes a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It provides full details of all key algorithms, for maximum understanding and utility. Num Pages: 588 pages, 167 black & white tables, biography. BIC Classification: TDPB; TJFC; UYF. Category: (G) General (US: Trade). Dimension: 235 x 155 x 30. Weight in Grams: 890.
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon ... Read more
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon ... Read more
Product Details
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Number of pages
588
Condition
New
Number of Pages
560
Place of Publication
New York, United States
ISBN
9781489986962
SKU
V9781489986962
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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