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Bond Graph Methodology
Wolfgang Borutzky
€ 253.15
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Description for Bond Graph Methodology
Paperback. This resource on bond graph methodology addresses fundamentals of the topic, state-of-the-art research, and advanced issues such as models of variable structure, bond graphs for sensitivity analysis and generations of equations for the study of robustness. Num Pages: 684 pages, 34 black & white tables, biography. BIC Classification: TBD; UGK. Category: (G) General (US: Trade). Dimension: 235 x 155 x 35. Weight in Grams: 1032.
Nowadays, engineering systems are of ever-increasing complexity and must be c- sidered asmultidisciplinary systems composed of interacting subsystems or system components from different engineering disciplines. Thus, an integration of various engineering disciplines, e.g, mechanical, electrical and control engineering in ac- current design approach is required. With regard to the systematic development and analysis of system models,interdisciplinary computer aided methodologies are - coming more and more important. A graphical description formalism particularly suited for multidisciplinary s- tems arebondgraphs devised by Professor Henry Paynter in as early as 1959 at the Massachusetts Institute of Technology (MIT) in Cambridge, Massachusetts, USA and in ... Read more
Nowadays, engineering systems are of ever-increasing complexity and must be c- sidered asmultidisciplinary systems composed of interacting subsystems or system components from different engineering disciplines. Thus, an integration of various engineering disciplines, e.g, mechanical, electrical and control engineering in ac- current design approach is required. With regard to the systematic development and analysis of system models,interdisciplinary computer aided methodologies are - coming more and more important. A graphical description formalism particularly suited for multidisciplinary s- tems arebondgraphs devised by Professor Henry Paynter in as early as 1959 at the Massachusetts Institute of Technology (MIT) in Cambridge, Massachusetts, USA and in ... Read more
Product Details
Format
Paperback
Publication date
2014
Publisher
Springer London Ltd United Kingdom
Number of pages
684
Condition
New
Number of Pages
662
Place of Publication
England, United Kingdom
ISBN
9781447157755
SKU
V9781447157755
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
About Wolfgang Borutzky
Dr Wolfgang Borutzky is a professor of modelling and simulation of engineering systems at Bonn-Rhein-Sieg University of Applied Sciences. He is a member of ASIM, the simulation society of Austria, Germany and Switzerland, and has contributed refereed papers to international conferences; notably the International Conference on Bond Graph Modelling and Simulation.
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