.png){kind=logo}
Stock image for illustration purposes only - book cover, edition or condition may vary.
Bond Graph Modelling of Engineering Systems
Wolfgang . Ed(S): Borutzky
€ 229.72
FREE Delivery in Ireland
Description for Bond Graph Modelling of Engineering Systems
Hardback. This compilation of contributions from experts across the world addresses readers in academia and industry who are concerned with control system design. It covers theoretical topics, applications in various areas as well as software for bond graph modelling. Editor(s): Borutzky, Wolfgang. Num Pages: 451 pages, biography. BIC Classification: TGB; TJFC; TJFM; UGC. Category: (P) Professional & Vocational. Dimension: 244 x 164 x 33. Weight in Grams: 840.
The author presents current work in bond graph methodology by providing a compilation of contributions from experts across the world that covers theoretical topics, applications in various areas as well as software for bond graph modeling.
It addresses readers in academia and in industry concerned with the analysis of multidisciplinary engineering systems or control system design who are interested to see how latest developments in bond graph methodology with regard to theory and applications can serve their needs in their engineering fields.
This presentation of advanced work in bond graph modeling presents the leading edge of ... Read more
The author presents current work in bond graph methodology by providing a compilation of contributions from experts across the world that covers theoretical topics, applications in various areas as well as software for bond graph modeling.
It addresses readers in academia and in industry concerned with the analysis of multidisciplinary engineering systems or control system design who are interested to see how latest developments in bond graph methodology with regard to theory and applications can serve their needs in their engineering fields.
This presentation of advanced work in bond graph modeling presents the leading edge of ... Read more
Product Details
Format
Hardback
Publication date
2011
Publisher
Springer-Verlag New York Inc. United States
Number of pages
451
Condition
New
Number of Pages
435
Place of Publication
New York, NY, United States
ISBN
9781441993670
SKU
V9781441993670
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
Reviews for Bond Graph Modelling of Engineering Systems