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Leventhal, Roy; Green, Lynne - Semiconductor Modeling - 9780387241593 - V9780387241593
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Semiconductor Modeling

€ 208.09
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Description for Semiconductor Modeling Hardback. Assists engineers in designing high-speed circuits. The emphasis is on semiconductor modeling, with PCB transmission line effects, equipment enclosure effects, and other modeling issues discussed as needed. This text addresses practical considerations, including process variation, model accuracy, validation and verification, and signal integrity. Num Pages: 766 pages, biography. BIC Classification: TJFC; TJFN; UGC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 41. Weight in Grams: 2810.

Semiconductor Modeling: For Simulating Signal, Power, and Electromagnetic Integrity assists engineers – both recent graduates and working product designers – in designing high-speed circuits. The authors apply circuit theory, circuit simulation tools, and practical experience to help the engineer understand semiconductor modeling as applied to high-speed digital designs. The emphasis is on semiconductor modeling, with PCB transmission line effects, equipment enclosure effects, and other modeling issues discussed as needed. The text addresses many practical considerations, including process variation, model accuracy, validation and verification, signal integrity, and design flow. Readers will benefit from its survey of modeling for semiconductors, packages, and ... Read more

Highlights include:

- Presents a very complete and well-balanced treatment of modeling of semiconductors, packages, and interconnects. Facilitates reader comprehension of the whole field of high-speed modeling, including digital and RF circuits.

- Combines practical modeling techniques with the latest EDA tools for simulation and successful high-speed digital design. Facilitates resolution of practical, every-day problems.

- Presents modeling from its historical roots to current state of the art. Facilitates keeping abreast of the latest modeling developments as they continue to unfold.

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Product Details

Format
Hardback
Publication date
2006
Publisher
Springer-Verlag New York Inc. United States
Number of pages
766
Condition
New
Number of Pages
766
Place of Publication
New York, NY, United States
ISBN
9780387241593
SKU
V9780387241593
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15

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