"Finally, a detailed analysis of the silicon interconnect coupling problem! This book not only addresses the coupling noise problem, but formulates and proposes usable CAD algorithms. Since the uncertainty in silicon design performance and reliability due to increasing coupling noise will only get worse each silicon generation, these algorithms will quickly find a gratefulhome in many CAD solutions." (William ... Read moreJ. Grundmann, Intel Fellow, Intel Corporation) "All signoff analyses - timing, coupling, power, temperature, and reliability - rely on the analysis of crosstalk noise. This book is an important contribution to the field: it provides a synthesis of analytic bounding of crosstalk effects, switching window convergence, and other recent elements of crosstalk methodology. It provides a level of understanding that will be essential for researchers, developers, and users of leading EDA tools going forward." (Andrew B. Kahng, Professor of CSE and ECE, University of California, San Diego) Show Less