.png){kind=logo}
Stock image for illustration purposes only - book cover, edition or condition may vary.
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
Yong Liu
€ 318.89
FREE Delivery in Ireland
Description for Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
paperback. This in-depth view of varied aspects of power electronic packaging systematically introduces design, assembly, reliability and failure analysis and materials selection, as well as covering the most advanced simulation and modeling techniques in the field. Num Pages: 594 pages, 80 black & white tables, biography. BIC Classification: PNFS; THRD; TJF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 31. Weight in Grams: 926.
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and ... Read more
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and ... Read more
Product Details
Format
Paperback
Publication date
2014
Publisher
Springer United States
Number of pages
594
Condition
New
Number of Pages
594
Place of Publication
New York, United States
ISBN
9781489987976
SKU
V9781489987976
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
Reviews for Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling