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Electronics Packaging Forum
James E. Morris
€ 64.14
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Description for Electronics Packaging Forum
Paperback. Num Pages: 468 pages, biography. BIC Classification: TDP; TJF. Category: (P) Professional & Vocational. Dimension: 229 x 152 x 24. Weight in Grams: 686.
Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed ... Read more
Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed ... Read more
Product Details
Format
Paperback
Publication date
2011
Publisher
Springer Netherlands
Number of pages
468
Condition
New
Number of Pages
460
Place of Publication
Dordrecht, Netherlands
ISBN
9789401066815
SKU
V9789401066815
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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