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He, Ming F.; Lu, Toh-Ming - Metal-Dielectric Interfaces in Gigascale Electronics - 9781461418115 - V9781461418115
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Metal-Dielectric Interfaces in Gigascale Electronics

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Description for Metal-Dielectric Interfaces in Gigascale Electronics Hardcover. This book presents a unified approach to understanding the diverse phenomena observed at metal-dielectric interfaces. It offers a clear account of the relationship between interface science and its applications in interconnect structures. Series: Springer Series in Materials Science. Num Pages: 160 pages, biography. BIC Classification: PNRH; TDPB; TGMB; TJFD. Category: (P) Professional & Vocational. Dimension: 243 x 169 x 14. Weight in Grams: 386.

Metal-dielectric interfaces are ubiquitous in modern electronics. As advanced gigascale electronic devices continue to shrink, the stability of these interfaces is becoming an increasingly important issue that has a profound impact on the operational reliability of these devices. In this book, the authors present the basic science underlying  the thermal and electrical stability of metal-dielectric interfaces and its relationship to the operation of advanced interconnect systems in gigascale electronics. Interface phenomena, including chemical reactions between metals and dielectrics, metallic-atom diffusion, and ion drift, are discussed based on fundamental physical and chemical principles. Schematic diagrams are provided throughout the book to ... Read more

Metal-Dielectric Interfaces in Gigascale Electronics  provides a unifying approach to the diverse and sometimes contradictory test results that are reported in the literature on metal-dielectric interfaces. The goal is to provide readers with a clear account of the relationship between interface science and its applications in interconnect structures. The material presented here will also be of interest to those engaged in field-effect transistor and memristor device research, as well as university researchers and industrial scientists working in the areas of electronic materials processing, semiconductor manufacturing, memory chips, and IC design. Show Less

Product Details

Format
Hardback
Publication date
2011
Publisher
Springer-Verlag New York Inc. United States
Number of pages
190
Condition
New
Series
Springer Series in Materials Science
Number of Pages
149
Place of Publication
New York, NY, United States
ISBN
9781461418115
SKU
V9781461418115
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15

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