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Three-Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures
Yuan Xie (Ed.)
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Description for Three-Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures
Hardback. This book presents an overview of the field of 3D IC design. There is emphasis on electronic design automation (EDA) tools and algorithms that can enable the adoption of 3D ICs, and the architectural implementation and potential for future 3D system design. Editor(s): Xie, Yuan; Cong, Jason; Sapatnekar, Sachin S. Series: Integrated Circuits and Systems. Num Pages: 284 pages, 1, black & white illustrations. BIC Classification: TDCK; TJFC; TJFD. Category: (P) Professional & Vocational. Dimension: 242 x 162 x 24. Weight in Grams: 592.
We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore's law. This observation stated that transistor density in integrated circuits doubles every 1. 5-2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore's law. The trouble began a number of years ago when CMOS devices were no longer able ... Read more
We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore's law. This observation stated that transistor density in integrated circuits doubles every 1. 5-2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore's law. The trouble began a number of years ago when CMOS devices were no longer able ... Read more
Product Details
Publisher
Springer-Verlag New York Inc. United States
Number of pages
298
Format
Hardback
Publication date
2009
Series
Integrated Circuits and Systems
Condition
New
Weight
591g
Number of Pages
284
Place of Publication
New York, NY, United States
ISBN
9781441907837
SKU
V9781441907837
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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