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Tin and Solder Plating in the Semiconductor Industry
A. C. Tan
€ 280.97
FREE Delivery in Ireland
Description for Tin and Solder Plating in the Semiconductor Industry
Hardback. Provides coverage of the theory and practice of plating semiconductor devices. This book introduces the principal concepts of plating and discusses its practice. It is designed to help electroplaters achieve 'zero-defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts. Num Pages: 348 pages, black & white illustrations. BIC Classification: TDM; TGP. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 234 x 156 x 20. Weight in Grams: 669.
The object of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The principal concepts of plating are introduced and best practice discussed. The book is designed to help electroplaters achieve `zero-defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts.
The object of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The principal concepts of plating are introduced and best practice discussed. The book is designed to help electroplaters achieve `zero-defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts.
Product Details
Format
Hardback
Publication date
1992
Publisher
Chapman and Hall United Kingdom
Number of pages
348
Condition
New
Number of Pages
326
Place of Publication
London, United Kingdom
ISBN
9780412482403
SKU
V9780412482403
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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