Stock image for illustration purposes only - book cover, edition or condition may vary.
Microelectronic Packaging: A Bibliography
A. H. Agajanian
€ 124.38
FREE Delivery in Ireland
Description for Microelectronic Packaging: A Bibliography
paperback. Series: IFI Data Base Library. Num Pages: 244 pages, biography. BIC Classification: GBCR; THR. Category: (P) Professional & Vocational. Dimension: 254 x 178 x 13. Weight in Grams: 493.
Microelectronic packaging protects and supports electronic devices and circuits and provides connections to the other parts of the system. The protection function avoids mechanical, electrical, chemical, contamination, and photo-optical damage, degeneration, and causes of malfunction. Hybrid microelectronic circuits and subsystem packages support the substrates; the substrate contains the circuit elements, (semiconductor devices or IC chips, deposited or chip resistors and capacitors, and attached inductors), as well as deposited and bonded interconnection wires. The connections to other parts of the system include electrical leads, heat removal paths, and mounting functions. At present, in order to meet the demands of VLSI, the ... Read more
Microelectronic packaging protects and supports electronic devices and circuits and provides connections to the other parts of the system. The protection function avoids mechanical, electrical, chemical, contamination, and photo-optical damage, degeneration, and causes of malfunction. Hybrid microelectronic circuits and subsystem packages support the substrates; the substrate contains the circuit elements, (semiconductor devices or IC chips, deposited or chip resistors and capacitors, and attached inductors), as well as deposited and bonded interconnection wires. The connections to other parts of the system include electrical leads, heat removal paths, and mounting functions. At present, in order to meet the demands of VLSI, the ... Read more
Product Details
Format
Paperback
Publication date
2012
Publisher
Springer United States
Number of pages
244
Condition
New
Series
IFI Data Base Library
Number of Pages
244
Place of Publication
New York, NY, United States
ISBN
9781468461077
SKU
V9781468461077
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
Reviews for Microelectronic Packaging: A Bibliography