3D Integration for NoC-based SoC Architectures
. Ed(S): Sheibanyrad, Abbas; Petrot, Frederic; Jantsch, Axel
€ 199.57
FREE Delivery in Ireland
Description for 3D Integration for NoC-based SoC Architectures
Hardback. 3D-Integration for NoC-based SoC Architectures gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. Editor(s): Sheibanyrad, Abbas; Petrot, Frederic; Jantsch, Axel. Series: Integrated Circuits and Systems. Num Pages: 278 pages, biography. BIC Classification: TJFC; UMZ. Category: (P) Professional & Vocational. Dimension: 229 x 152 x 17. Weight in Grams: 584.
This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
Product Details
Format
Hardback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Number of pages
278
Condition
New
Series
Integrated Circuits and Systems
Number of Pages
278
Place of Publication
New York, NY, United States
ISBN
9781441976178
SKU
V9781441976178
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
Reviews for 3D Integration for NoC-based SoC Architectures