3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
Ibrahim M. Elfadel (Ed.)
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Description for 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
Hardback. Editor(s): Elfadel, Ibrahim M.; Fettweis, Gerhard. Num Pages: 214 pages, 193 black & white illustrations, 85 colour illustrations, 22 black & white tables, 193 co. BIC Classification: TJFC; UYF. Category: (P) Professional & Vocational. Dimension: 235 x 155. .
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems. ... Read more
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems. ... Read more
Product Details
Publisher
Springer International Publishing AG
Format
Hardback
Publication date
2016
Condition
New
Weight
693g
Number of Pages
339
Place of Publication
Cham, Switzerland
ISBN
9783319204802
SKU
V9783319204802
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
About Ibrahim M. Elfadel (Ed.)
Ibrahim (Abe) M. Elfadel has 15 years of industrial experience in the research, development and deployment of advanced computer-aided design (CAD) tools and methodologies for deep-submicron, high-performance digital designs. Most recently, he played a key role in the development and deployment of IBM's next-generation layout verification tools for the ultra-deep submicron CMOS technology nodes. Dr. Elfadel is the recipient of ... Read more
Reviews for 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
The book is valuable as a learning tool for 3D stacked chips through TSVs ... . a valuable addition to a scientific library, as well as served as good introduction for device reliability engineers or specialists and industrials involved in the field of 3D stacking in wafer fabrication and integrated circuit design. ... highly recommended for people who desire a ... Read more