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Advanced Electronic Packaging
Richard K. Ulrich
€ 210.97
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Description for Advanced Electronic Packaging
Hardcover. This book updates the book, Advanced Electronic Packaging: With Emphasis on Multichip Modules, Ed.W.D. Brown, IEEE Press, copyright 1999. The original edition of the book has been widely adopted by industry and has been and is still being adopted by universities for graduate courses. Editor(s): Ulrich, Richard K.; Brown, William D. Series: IEEE Press Series on Microelectronic Systems. Num Pages: 840 pages, illustrations. BIC Classification: TJ. Category: (P) Professional & Vocational. Dimension: 190 x 264 x 51. Weight in Grams: 1728.
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained.
An Instructor's Manual presenting detailed solutions to all the problems in the book ... Read more
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained.
An Instructor's Manual presenting detailed solutions to all the problems in the book ... Read more
Product Details
Format
Hardback
Publication date
2006
Publisher
John Wiley and Sons Ltd United Kingdom
Number of pages
840
Condition
New
Series
IEEE Press Series on Microelectronic Systems
Number of Pages
848
Place of Publication
, United States
ISBN
9780471466093
SKU
V9780471466093
Shipping Time
Usually ships in 7 to 11 working days
Ref
99-50
About Richard K. Ulrich
Richard K. Ulrich is a professor of chemical engineering at the University of Arkansas. He is a book editor and columnist on embedded passive technology, a NEMI committee member, an associate editor of IEEE Transactions on Advanced Packaging, and past chairman of chairman of the Dielectric Science and Technology Division of the Electrochemical Society. WILLIAM D. BROWN, PhD, is ... Read more
Reviews for Advanced Electronic Packaging
"…a very nice reference." (IEEE Circuits & Devices Magazine, November/December 2006) "...offers a broad perspective on electronic packaging." (Advanced Packaging Online, August 11, 2006) "...an extremely thorough engineering textbook and an invaluable reference tool...get ready for some serious reading that will pay off." (Chip Scale Review, July 2006) "…useful to not only students but also ... Read more