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N/A - Advanced Flip Chip Packaging - 9781441957672 - V9781441957672
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Advanced Flip Chip Packaging

€ 254.23
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Description for Advanced Flip Chip Packaging Hardcover. Flip chip packaging is used in computing, communications, consumer and automotive electronics. This book discusses past, present and future advances in flip chip packaging, covering trends in substrate technology, material development and assembly processes. Editor(s): Tong, Ho-Ming; Lai, Yi-Shao; Wong, C. P. Num Pages: 560 pages, 171 black & white illustrations, 242 colour illustrations, 37 black & white tables. BIC Classification: TJF; TJFC; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 243 x 162 x 26. Weight in Grams: 922.

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

Product Details

Format
Hardback
Publication date
2013
Publisher
Springer-Verlag New York Inc. United States
Number of pages
500
Condition
New
Number of Pages
560
Place of Publication
New York, NY, United States
ISBN
9781441957672
SKU
V9781441957672
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15

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