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Advanced Interconnects for ULSI Technology
. Ed(S): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried
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Description for Advanced Interconnects for ULSI Technology
Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Editor(s): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried. Num Pages: 606 pages, Illustrations. BIC Classification: TJFD. Category: (P) Professional & Vocational. Dimension: 248 x 171 x 32. Weight in Grams: 1058.
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance.
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance.
Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses:
... Read moreProduct Details
Publication date
2012
Publisher
John Wiley and Sons Ltd United States
Number of pages
606
Condition
New
Number of Pages
608
Format
Hardback
Place of Publication
New York, United States
ISBN
9780470662540
SKU
V9780470662540
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
About . Ed(S): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried
Mikhail R. Baklanov IMEC, Leuven, Belgium Paul S. Ho Laboratory for Interconnect and Packaging, University of Texas at Austin, Austin, Texas, USA Ehrenfried Zschech Fraunhofer Institute for Nondestructive Testing, Dresden, Germany
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