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. Ed(S): Shacham-Diamand, Yosi; Osaka, Tetsuya; Datta, Madhav; Ohba, Takayuki - Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications - 9781461497448 - V9781461497448
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Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

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Description for Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications paperback. Electromechanical processes for Ultra-large-Scale Integration technology for Integrated Circuits applications is a new frontier in electrochemistry and science. This book details copper based interconnect technology for ULSI technology to ICs application. Editor(s): Shacham-Diamand, Yosi; Osaka, Tetsuya; Datta, Madhav; Ohba, Takayuki. Num Pages: 572 pages, 31 black & white tables, biography. BIC Classification: PNRH; TBN; TDC; TGM; THR. Category: (G) General (US: Trade). Dimension: 235 x 155 x 29. Weight in Grams: 866.
In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing ... Read more

Product Details

Format
Paperback
Publication date
2014
Publisher
Springer United States
Number of pages
572
Condition
New
Number of Pages
552
Place of Publication
New York, NY, United States
ISBN
9781461497448
SKU
V9781461497448
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15

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