.png){kind=logo}
Stock image for illustration purposes only - book cover, edition or condition may vary.
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Sung Kyu Lim
€ 196.89
FREE Delivery in Ireland
Description for Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Hardback. This book describes a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It provides full details of all key algorithms, for maximum understanding and utility. Num Pages: 560 pages, 167 black & white tables, biography. BIC Classification: TDPB; TJFC. Category: (P) Professional & Vocational. Dimension: 161 x 241 x 37. Weight in Grams: 1010.
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon ... Read more
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon ... Read more
Product Details
Format
Hardback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Number of pages
560
Condition
New
Number of Pages
560
Place of Publication
New York, NY, United States
ISBN
9781441995414
SKU
V9781441995414
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
Reviews for Design for High Performance, Low Power, and Reliable 3D Integrated Circuits