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Design, Simulation and Applications of Inductors and Transformers for Si RF ICs
Niknejad, Ali M. (University Of California At Berkeley); Meyer, Robert G.
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Description for Design, Simulation and Applications of Inductors and Transformers for Si RF ICs
Paperback. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 190 pages, biography. BIC Classification: THR; TJFC; UGC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 12. Weight in Grams: 338.
The modern wireless communication industry has put great demands on circuit designers for smaller, cheaper transceivers in the gigahertz frequency range. One tool which has assisted designers in satisfying these requirements is the use of on-chip inductiveelements (inductors and transformers) in silicon (Si) radio-frequency (RF) integrated circuits (ICs). These elements allow greatly improved levels of performance in Si monolithic low-noise amplifiers, power amplifiers, up-conversion and down-conversion mixers and local oscillators. Inductors can be used to improve the intermodulation distortion performance and noise figure of small-signal amplifiers and mixers. In addition, the gain of amplifier stages can be enhanced and the ... Read more
The modern wireless communication industry has put great demands on circuit designers for smaller, cheaper transceivers in the gigahertz frequency range. One tool which has assisted designers in satisfying these requirements is the use of on-chip inductiveelements (inductors and transformers) in silicon (Si) radio-frequency (RF) integrated circuits (ICs). These elements allow greatly improved levels of performance in Si monolithic low-noise amplifiers, power amplifiers, up-conversion and down-conversion mixers and local oscillators. Inductors can be used to improve the intermodulation distortion performance and noise figure of small-signal amplifiers and mixers. In addition, the gain of amplifier stages can be enhanced and the ... Read more
Product Details
Format
Paperback
Publication date
2013
Publisher
Springer-Verlag New York Inc. United States
Number of pages
190
Condition
New
Series
The Springer International Series in Engineering and Computer Science
Number of Pages
190
Place of Publication
New York, NY, United States
ISBN
9781475773668
SKU
V9781475773668
Shipping Time
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Ref
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