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Dielectric Breakdown in Gigascale Electronics
Toh-Ming Lu
€ 71.34
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Description for Dielectric Breakdown in Gigascale Electronics
Paperback. Series: SpringerBriefs in Materials. Num Pages: 113 pages, 41 black & white illustrations, 33 colour illustrations, 31 colour tables, biography. BIC Classification: TBN; TDPB; TJFC. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 6. Weight in Grams: 191.
This book focuses on the experimental and theoretical aspects of the time-dependent breakdown of advanced dielectric films used in gigascale electronics. Coverage includes the most important failure mechanisms for thin low-k films, new and established experimental techniques, recent advances in the area of dielectric failure, and advanced simulations/models to resolve and predict dielectric breakdown, all of which are of considerable importance for engineers and scientists working on developing and integrating present and future chip architectures. The book is specifically designed to aid scientists in assessing the reliability and robustness of electronic systems employing low-k dielectric materials such as nano-porous films. ... Read more
This book focuses on the experimental and theoretical aspects of the time-dependent breakdown of advanced dielectric films used in gigascale electronics. Coverage includes the most important failure mechanisms for thin low-k films, new and established experimental techniques, recent advances in the area of dielectric failure, and advanced simulations/models to resolve and predict dielectric breakdown, all of which are of considerable importance for engineers and scientists working on developing and integrating present and future chip architectures. The book is specifically designed to aid scientists in assessing the reliability and robustness of electronic systems employing low-k dielectric materials such as nano-porous films. ... Read more
Product Details
Format
Paperback
Publication date
2016
Publisher
Springer International Publishing AG Switzerland
Number of pages
113
Condition
New
Series
SpringerBriefs in Materials
Number of Pages
105
Place of Publication
Cham, Switzerland
ISBN
9783319432182
SKU
V9783319432182
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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