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Directions for the Next Generation of MMIC Devices and Systems
. Ed(S): Das, Nirod K.; Bertoni, Henry L.
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Description for Directions for the Next Generation of MMIC Devices and Systems
Hardback. Proceedings of the 1996 WRI International Symposium held in New York City, September 11-13, 1996 Editor(s): Das, Nirod K.; Bertoni, Henry L. Num Pages: 415 pages, biography. BIC Classification: TJFN. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 254 x 178 x 24. Weight in Grams: 2280.
Microwave and millimeter-wave integrated circuits (MMICs) are of increasing im- portance in modern military and commercial wireless communication systems. Current trends are towards low-cost, high-density, multilevel,and multifunctional integration, cover- ingmillimeterand submillimeterwave regions.The integrationofdiverse subfunctions, such as light-wave devices, superconductor circuits, digital circuits and ferrite devices, together with conventional microwave or millimeter-wave devices, circuits and antennas, will allow implementation of large systems on a single chip. Research on advanced device concepts, 3-D interconnects, high-performance packaging methods, advanced CAD-tools, measure- ment and testing techniques, as weil as material and fabrication technologies, are being di- rected to meet these new challenges. Continuing on ... Read more
Microwave and millimeter-wave integrated circuits (MMICs) are of increasing im- portance in modern military and commercial wireless communication systems. Current trends are towards low-cost, high-density, multilevel,and multifunctional integration, cover- ingmillimeterand submillimeterwave regions.The integrationofdiverse subfunctions, such as light-wave devices, superconductor circuits, digital circuits and ferrite devices, together with conventional microwave or millimeter-wave devices, circuits and antennas, will allow implementation of large systems on a single chip. Research on advanced device concepts, 3-D interconnects, high-performance packaging methods, advanced CAD-tools, measure- ment and testing techniques, as weil as material and fabrication technologies, are being di- rected to meet these new challenges. Continuing on ... Read more
Product Details
Format
Hardback
Publication date
1997
Publisher
Springer Science+Business Media United States
Number of pages
415
Condition
New
Number of Pages
415
Place of Publication
, United States
ISBN
9780306457692
SKU
V9780306457692
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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