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. Ed(S): Tummala, R. R.; Kosec, Marija; Jones, W.K.; Belavic, Darko - Electronic Packaging for High Reliability, Low Cost Electronics - 9780792352181 - V9780792352181
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Electronic Packaging for High Reliability, Low Cost Electronics

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Description for Electronic Packaging for High Reliability, Low Cost Electronics Hardback. Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997 Editor(s): Tummala, R. R.; Kosec, Marija; Jones, W.K.; Belavic, Darko. Series: NATO Science Partnership Subseries: 3. Num Pages: 306 pages, biography. BIC Classification: TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 19. Weight in Grams: 1360.
Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded ... Read more

Product Details

Format
Hardback
Publication date
2000
Publisher
Kluwer Academic Publishers United States
Number of pages
306
Condition
New
Series
NATO Science Partnership Subseries: 3
Number of Pages
296
Place of Publication
Dordrecht, Netherlands
ISBN
9780792352181
SKU
V9780792352181
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15

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