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Electronics & communications engineering

Results 1281 - 1300 of 11676

Electronics & communications engineering

Hardback. Editor(s): Kalia, Susheel. Series: Springer Series on Polymer and Composite Materials. Num Pages: 234 pages, 67 black & white illustrations, 38 colour illustrations, biography. BIC Classification: PHF; TDCP; TGM; TJFD. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 16. Weight in Grams: 532.
Format
Hardback
Publication date
2015
Publisher
Springer International Publishing AG Switzerland
Number of pages
234
Condition
New
SKU
V9783319253206
ISBN
9783319253206
Hardback
Condition: New

€ 128.19

Paperback. Addresses communication skills fundamental to engineering success. Grounded in rhetorical theory, the book helps engineers develop flexible strategies for researching, inventing, drafting, and revising, and for meeting the challenges of the audiences, purposes, and contexts encountered at work. Num Pages: 384 pages, Ill. BIC Classification: TBC; TJK. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 255 x 180 x 13. Weight in Grams: 567.
Format
Paperback
Publication date
2001
Publisher
John Wiley and Sons Ltd United States
Edition
1st Edition
Number of pages
384
Condition
New
SKU
V9780471128175
ISBN
9780471128175
Paperback
Condition: New

€ 127.96

Paperback. Series: Smart Sensors, Measurement and Instrumentation. Num Pages: 192 pages, 71 black & white illustrations, 2 colour illustrations, biography. BIC Classification: MJX; TJF; TTBM; UYQ. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 10. Weight in Grams: 302.
Format
Paperback
Publication date
2016
Publisher
Springer International Publishing AG Switzerland
Edition
Softcover reprint of the original 1st ed. 2015
Number of pages
192
Condition
New
SKU
V9783319365244
ISBN
9783319365244
Paperback
Condition: New

€ 126.56

Hardcover. Smart Homes Series: Smart Sensors, Measurement and Instrumentation. Num Pages: 180 pages, 71 black & white illustrations, 2 colour illustrations, biography. BIC Classification: TJF; UYQ. Category: (P) Professional & Vocational. Dimension: 247 x 162 x 16. Weight in Grams: 428.
Format
Hardback
Publication date
2015
Publisher
Springer
Edition
2015th Edition
Condition
New
SKU
V9783319135564
ISBN
9783319135564
Hardback
Condition: New

€ 127.70

hardcover. This book examines characterization and evaluation of a semi-large aperture photoconducting antenna fabricated on Fe-doped bulk Ga0.69In0.31As substrate as a high-power terahertz radiation source for time-domain terahertz spectroscopy and imaging systems. Series: Springer Theses. Num Pages: 88 pages, 12 black & white tables. BIC Classification: PNFS; TJFD5; TTBL. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 6. Weight in Grams: 670.
Format
Hardback
Publication date
2011
Publisher
Springer United States
Edition
2011th Edition
Number of pages
88
Condition
New
SKU
V9781441981974
ISBN
9781441981974
Hardback
Condition: New

€ 129.17

Paperback. This book examines characterization and evaluation of a semi-large aperture photoconducting antenna fabricated on Fe-doped bulk Ga0.69In0.31As substrate as a high-power terahertz radiation source for time-domain terahertz spectroscopy and imaging systems. Series: Springer Theses. Num Pages: 88 pages, 12 black & white tables, biography. BIC Classification: PNFS; TJFD5; TTBL. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 4. Weight in Grams: 150.
Format
Paperback
Publication date
2013
Publisher
Springer-Verlag New York Inc. United States
Number of pages
88
Condition
New
SKU
V9781461428275
ISBN
9781461428275
Paperback
Condition: New

€ 125.71

Paperback. This book explores fabrication and circuit modeling of quantum dot gate field effect transistor (QDGFET) and quantum dot gate NMOS inverter, introduces a circuit model of QDGFET based on Berkley Short Channel IGFET model and simulation of advanced circuits. Num Pages: 148 pages, 72 black & white illustrations, 49 colour illustrations, 24 black & white tables, biograp. BIC Classification: PHQ; TBN; TDPB; TJFC. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 8. Weight in Grams: 238.
Format
Paperback
Publication date
2016
Publisher
Springer, India, Private Ltd India
Edition
Softcover reprint of the original 1st ed. 2014
Number of pages
148
Condition
New
SKU
V9788132234906
ISBN
9788132234906
Paperback
Condition: New

€ 127.73

Hardback. Novel Three-state Quantum Dot Gate Field Effect Transistor Num Pages: 134 pages, 72 black & white illustrations, 49 colour illustrations, 24 black & white tables, biograp. BIC Classification: TDPB; TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 9. Weight in Grams: 391.
Format
Hardback
Publication date
2013
Publisher
Springer, India, Private Ltd India
Number of pages
134
Condition
New
SKU
V9788132216346
ISBN
9788132216346
Hardback
Condition: New

€ 127.30

Paperback. Num Pages: 196 pages, biography. BIC Classification: TGM; THR; TJFD5. Category: (P) Professional & Vocational. Dimension: 229 x 152 x 10. Weight in Grams: 294.
Format
Paperback
Publication date
2011
Publisher
Springer Netherlands
Edition
Softcover reprint of the original 1st ed. 1990
Number of pages
196
Condition
New
SKU
V9789401066617
ISBN
9789401066617
Paperback
Condition: New

€ 126.74

Paperback. The author believes that the best way to learn new algorithms is by working through a small example by hand. That's why this book contains problems and solutions related to various well-known algorithms widely used in VLSI physical design automation. Num Pages: 264 pages, biography. BIC Classification: TJFC; U. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 15. Weight in Grams: 456.
Format
Paperback
Publication date
2010
Publisher
Springer Netherlands
Edition
1st ed. Softcover of orig. ed. 2008
Number of pages
264
Condition
New
SKU
V9789048176823
ISBN
9789048176823
Paperback
Condition: New

€ 194.20

Paperback. This book describes a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It provides full details of all key algorithms, for maximum understanding and utility. Num Pages: 588 pages, 167 black & white tables, biography. BIC Classification: TDPB; TJFC; UYF. Category: (G) General (US: Trade). Dimension: 235 x 155 x 30. Weight in Grams: 890.
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Number of pages
588
Condition
New
SKU
V9781489986962
ISBN
9781489986962
Paperback
Condition: New

€ 141.25

Hardback. This book describes a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It provides full details of all key algorithms, for maximum understanding and utility. Num Pages: 560 pages, 167 black & white tables, biography. BIC Classification: TDPB; TJFC. Category: (P) Professional & Vocational. Dimension: 161 x 241 x 37. Weight in Grams: 1010.
Format
Hardback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Edition
2012
Number of pages
560
Condition
New
SKU
V9781441995414
ISBN
9781441995414
Hardback
Condition: New

€ 196.89

Hardback. The author believes that the best way to learn new algorithms is by working through a small example by hand. That's why this book contains problems and solutions related to various well-known algorithms widely used in VLSI physical design automation. Num Pages: 264 pages, biography. BIC Classification: TJFC; U. Category: (P) Professional & Vocational. Dimension: 241 x 163 x 21. Weight in Grams: 574.
Format
Hardback
Publication date
2008
Publisher
Springer-Verlag New York Inc. United States
Number of pages
264
Condition
New
SKU
V9781402066269
ISBN
9781402066269
Hardback
Condition: New

€ 195.06

Hardback. Editor(s): Vaidyanathan, Sundarapandian; Volos, Christos. Series: Studies in Computational Intelligence. Num Pages: 609 pages, 82 black & white illustrations, 262 colour illustrations, biography. BIC Classification: GPFC; TJFM; UNH; UYA. Category: (G) General (US: Trade). Dimension: 244 x 165 x 39. Weight in Grams: 1060.
Publisher
Springer International Publishing AG
Format
Hardback
Publication date
2016
Edition
1st ed. 2016
Condition
New
SKU
V9783319302782
ISBN
9783319302782
Hardback
Condition: New

€ 197.92

Paperback. Series: Communications and Control Engineering. Num Pages: 305 pages, biography. BIC Classification: TJFM. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 16. Weight in Grams: 435.
Format
Paperback
Publication date
2010
Publisher
Springer London Ltd United Kingdom
Edition
Softcover reprint of hardcover 1st ed. 2005
Number of pages
305
Condition
New
SKU
V9781849969505
ISBN
9781849969505
Paperback
Condition: New

€ 194.44

Hardback. This book presents a thorough investigation of stability effects on three broad classes of switching mechanism: arbitrary switching, constrained switching, and designed switching. Includes many motivating and illustrative examples. Series: Communications and Control Engineering. Num Pages: 276 pages, 1 black & white tables, biography. BIC Classification: PBT; PBW; TGMD4; TJFM. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 20. Weight in Grams: 629.
Format
Hardback
Publication date
2011
Publisher
Springer London Ltd United Kingdom
Number of pages
276
Condition
New
SKU
V9780857292551
ISBN
9780857292551
Hardback
Condition: New

€ 128.99

Paperback. This book presents a thorough investigation of stability effects on three broad classes of switching mechanism: arbitrary switching, constrained switching, and designed switching. Includes many motivating and illustrative examples. Series: Communications and Control Engineering. Num Pages: 276 pages, 1 black & white tables, biography. BIC Classification: GPFC; PBF; PBT; TGMD4; TJFM. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 15. Weight in Grams: 427.
Format
Paperback
Publication date
2013
Publisher
Springer London Ltd United Kingdom
Number of pages
276
Condition
New
SKU
V9781447126249
ISBN
9781447126249
Paperback
Condition: New

€ 127.54

Hardback. This text presents the fundamentals and applications of strain in semiconductors and semiconductor devices that is relevant for strain-enhanced advanced CMOS technology and strain-based piezoresistive MEMS transducers. Num Pages: 350 pages, biography. BIC Classification: PHFC; TJFD5. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 20. Weight in Grams: 1510.
Format
Hardback
Publication date
2009
Publisher
Springer-Verlag New York Inc. United States
Number of pages
350
Condition
New
SKU
V9781441905512
ISBN
9781441905512
Hardback
Condition: New

€ 201.04

Paperback. This text presents the fundamentals and applications of strain in semiconductors and semiconductor devices that is relevant for strain-enhanced advanced CMOS technology and strain-based piezoresistive MEMS transducers. Num Pages: 362 pages, biography. BIC Classification: PHF; PNFS; TJF; TJFD. Category: (G) General (US: Trade). Dimension: 235 x 155 x 19. Weight in Grams: 557.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
362
Condition
New
SKU
V9781489983152
ISBN
9781489983152
Paperback
Condition: New

€ 194.82

Paperback. This book discusses the design of wireless power transfer systems for medical applications, including challenges faced in developing a wirelessly powered implant: power transfer efficiency, power stability and the size of power antennas and circuits. Num Pages: 194 pages, 9 black & white tables, biography. BIC Classification: MQW; TJF; TJFC. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 11. Weight in Grams: 308.
Format
Paperback
Publication date
2013
Publisher
Springer-Verlag New York Inc. United States
Number of pages
194
Condition
New
SKU
V9781489991454
ISBN
9781489991454
Paperback
Condition: New

€ 137.71

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