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Electronics & communications engineering
Results 981 - 1000 of 11682
Electronics & communications engineering
Paperback. Editor(s): Lande, Tor Sverre. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 479 pages, biography. BIC Classification: PHS; THR; TJFC; UY. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 25. Weight in Grams: 735.
- Format
- Paperback
- Publication date
- 2013
- Publisher
- Springer-Verlag New York Inc. United States
- Edition
- Softcover reprint of the original 1st ed. 1998
- Number of pages
- 479
- Condition
- New
- SKU
- V9781475782981
- ISBN
- 9781475782981
Paperback
Condition: New
€ 196.00
€ 196.00
Hardback. The term neuromorphic expresses relations to computational models found in biological neural systems, which are used as inspiration for building large electronic systems in silicon. This title views developments within neuromorphic engineering from different perspectives. It provides neuromorphic systems descriptions with foundations in silicon. Editor(s): Lande, Tor Sverre. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 479 pages, biography. BIC Classification: TJF; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 234 x 156 x 26. Weight in Grams: 851.
- Format
- Hardback
- Publication date
- 1998
- Publisher
- Kluwer Academic Publishers United States
- Number of pages
- 479
- Condition
- New
- SKU
- V9780792381587
- ISBN
- 9780792381587
Hardback
Condition: New
€ 203.47
€ 203.47
Hardcover. Together with the internet site, this book is suitable for independent and remote study. The Web site is kept to date and guest educational institutions are invited to join in creating their own lab modules on different device aspects. Num Pages: 256 pages, index. BIC Classification: TJF; UDB. Category: (P) Professional & Vocational. Dimension: 236 x 161 x 17. Weight in Grams: 484.
- Format
- Hardback
- Publication date
- 2003
- Publisher
- John Wiley and Sons Ltd United States
- Edition
- 1st Edition
- Number of pages
- 256
- Condition
- New
- SKU
- V9780471413752
- ISBN
- 9780471413752
Hardback
Condition: New
€ 175.10
€ 175.10
Hardcover. An introduction to SPICE-oriented semiconductor device modeling. The SPICE program allows engineers to simulate both individual devices and electronic circuits, performing a large number of different analyses needed for tasks such as verification of circuit designs and prediction of circuit performance. Num Pages: 424 pages, Illustrations. BIC Classification: PHFC; THRD; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 238 x 165 x 29. Weight in Grams: 794.
- Format
- Hardback
- Publication date
- 1997
- Publisher
- John Wiley & Sons Inc United States
- Edition
- 1st Edition
- Number of pages
- 424
- Condition
- New
- SKU
- V9780471157786
- ISBN
- 9780471157786
Hardback
Condition: New
€ 201.86
€ 201.86
Paperback. This book examines orientation effects and anisotropy in piezo-active composites. It provides smart-materials applications and reveals the interconnections between microgeometry, electromechanical properties and their anisotropy in composites. Series: Springer Series in Materials Science. Num Pages: 184 pages, 17 black & white illustrations, 31 colour illustrations, biography. BIC Classification: PHV; PNR; TGMB; TGMT; TJF; TJFD. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 10. Weight in Grams: 297.
- Format
- Paperback
- Publication date
- 2016
- Publisher
- Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
- Edition
- Softcover reprint of the original 1st ed. 2014
- Number of pages
- 184
- Condition
- New
- SKU
- V9783662509562
- ISBN
- 9783662509562
Paperback
Condition: New
€ 126.53
€ 126.53
Hardback. This book examines orientation effects and anisotropy in piezo-active composites. It provides smart-materials applications and reveals the interconnections between microgeometry, electromechanical properties and their anisotropy in composites. Series: Springer Series in Materials Science. Num Pages: 184 pages, 17 black & white illustrations, 31 colour illustrations, biography. BIC Classification: PHV; PNR; TGMB; TGMT; TJF; TJFD. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 18. Weight in Grams: 450.
- Format
- Hardback
- Publication date
- 2013
- Publisher
- Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
- Number of pages
- 184
- Condition
- New
- SKU
- V9783642383533
- ISBN
- 9783642383533
Hardback
Condition: New
€ 126.98
€ 126.98
Hardcover. This book educates readers on how to apply application threat modeling as a more advanced preventive form of security, describing countermeasures to security threats. Num Pages: 696 pages. BIC Classification: JKV; TJ; UT. Category: (P) Professional & Vocational. Dimension: 164 x 257 x 41. Weight in Grams: 1074.
- Format
- Hardback
- Publication date
- 2015
- Publisher
- John Wiley & Sons Inc United Kingdom
- Edition
- 1st Edition
- Number of pages
- 450
- Condition
- New
- SKU
- V9780470500965
- ISBN
- 9780470500965
Hardback
Condition: New
€ 122.87
€ 122.87
Paperback. Series: SpringerBriefs in Electrical and Computer Engineering. Num Pages: 61 pages, 15 black & white illustrations, biography. BIC Classification: TJK; UKN; UT. Category: (P) Professional & Vocational. Dimension: 236 x 156 x 12. Weight in Grams: 124.
- Format
- Paperback
- Publication date
- 2016
- Publisher
- Springer International Publishing AG Switzerland
- Number of pages
- 61
- Condition
- New
- SKU
- V9783319437132
- ISBN
- 9783319437132
Paperback
Condition: New
€ 72.17
€ 72.17
Paperback. Num Pages: 355 pages, biography. BIC Classification: TJFM; UM. Category: (G) General (US: Trade). Dimension: 233 x 190 x 18. Weight in Grams: 584. 314 pages, black & white illustrations. Cateogry: (G) General (US: Trade). BIC Classification: TJFM; UM. Dimension: 233 x 190 x 18. Weight: 584.
- Format
- Paperback
- Publication date
- 2012
- Publisher
- Apress
- Edition
- 1st Edition
- Number of pages
- 314
- Condition
- New
- SKU
- V9781430243595
- ISBN
- 9781430243595
Paperback
Condition: New
€ 48.99€ 40.89
€ 48.99
€ 40.89
Comprehensive coverage explaining the correlation and synergy between Next Generation Networks and the existing standardized technologies This book focuses on Next Generation Networks (NGN); in particular, on NGN architectures, protocols and services, including technologies, regulation and business aspects. Num Pages: 366 pages, black & white tables, figures. BIC Classification: TJK. Category: (P) Professional & Vocational. Dimension: 252 x 176 x 22. Weight in Grams: 718.
- Publication date
- 2014
- Publisher
- John Wiley & Sons Inc United States
- Number of pages
- 366
- Condition
- New
- SKU
- V9781118607206
- ISBN
- 9781118607206
Paperback
Condition: New
€ 126.10
€ 126.10
Paperback. Series: Communications and Control Engineering. Num Pages: 374 pages, biography. BIC Classification: THR; TJFM; TJFM1. Category: (P) Professional & Vocational. Dimension: 158 x 236 x 29. Weight in Grams: 598.
- Publisher
- Springer London Ltd
- Format
- Paperback
- Publication date
- 2011
- Edition
- Softcover reprint of the original 1st ed. 1995
- Condition
- New
- SKU
- V9781447130390
- ISBN
- 9781447130390
Paperback
Condition: New
€ 150.87
€ 150.87
paperback. This book offers a comprehensive approach to advanced thermal management in electronic packaging, including the fundamentals of heat transfer, component design guidelines, materials selection, cooling, characterization, processing and manufacturing and more. Series: Springer Series in Advanced Microelectronics. Num Pages: 640 pages, 26 black & white tables, biography. BIC Classification: TGMB; TJF; TJFC; TJFD. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 33. Weight in Grams: 967.
- Format
- Paperback
- Publication date
- 2013
- Publisher
- Springer United States
- Edition
- 2011th Edition
- Number of pages
- 640
- Condition
- New
- SKU
- V9781461427926
- ISBN
- 9781461427926
Paperback
Condition: New
€ 319.01
€ 319.01
Hardback. This book offers a comprehensive approach to advanced thermal management in electronic packaging, including the fundamentals of heat transfer, component design guidelines, materials selection, cooling, characterization, processing and manufacturing and more. Series: Springer Series in Advanced Microelectronics. Num Pages: 640 pages, 26 black & white tables, biography. BIC Classification: TGMB; TJFC; TJFD. Category: (P) Professional & Vocational. Dimension: 242 x 159 x 53. Weight in Grams: 1102.
- Format
- Hardback
- Publication date
- 2011
- Publisher
- Springer-Verlag New York Inc. United States
- Number of pages
- 640
- Condition
- New
- SKU
- V9781441977588
- ISBN
- 9781441977588
Hardback
Condition: New
€ 320.16
€ 320.16
Hardcover. Num Pages: 281 pages, illustrations. BIC Classification: TJKW. Category: (P) Professional & Vocational. Dimension: 260 x 184 x 29. Weight in Grams: 992.
- Format
- Hardback
- Publication date
- 2008
- Publisher
- Nova Science Publishers Inc United States
- Number of pages
- 281
- Condition
- New
- SKU
- V9781600216749
- ISBN
- 9781600216749
Hardback
Condition: New
€ 237.80€ 162.43
€ 237.80
€ 162.43
paperback. This book presents cutting edge material science research from the Research Center of Advanced Structural and Functional Materials Design in Japan's Osaka University, especially the fusion of structural and functional materials such as medical bone materials. Editor(s): Kakeshita, Tomoyuki. Num Pages: 300 pages, biography. BIC Classification: TGM; TGMT; TJFD. Category: (G) General (US: Trade). Dimension: 235 x 155 x 16. Weight in Grams: 462.
- Format
- Paperback
- Publication date
- 2014
- Publisher
- Springer Verlag, Japan Japan
- Edition
- 2013th Edition
- Number of pages
- 300
- Condition
- New
- SKU
- V9784431547471
- ISBN
- 9784431547471
Paperback
Condition: New
€ 127.52
€ 127.52
Hardback. A practical advanced text giving a solid introduction to mobile systems programming. The book is the only platform-independent introduction to programming mobile systems. To design software for mobile devices developers must combine properties commonly associated with embedded systems and workstation programming. Num Pages: 244 pages, Illustrations. BIC Classification: TJKT1; UM. Category: (P) Professional & Vocational. Dimension: 248 x 174 x 19. Weight in Grams: 614.
- Format
- Hardback
- Publication date
- 2007
- Publisher
- John Wiley & Sons Inc United States
- Number of pages
- 244
- Condition
- New
- SKU
- V9780470057384
- ISBN
- 9780470057384
Hardback
Condition: New
€ 83.36
€ 83.36
Paperback. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 173 pages, biography. BIC Classification: THR; TJFM; UYQ; UYQV. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 10. Weight in Grams: 296.
- Format
- Paperback
- Publication date
- 2013
- Publisher
- Springer-Verlag New York Inc. United States
- Edition
- Softcover reprint of the original 1st ed. 1990
- Number of pages
- 173
- Condition
- New
- SKU
- V9781461288329
- ISBN
- 9781461288329
Paperback
Condition: New
€ 126.68
€ 126.68
Linear, Time-varying Approximations to Nonlinear Dynamical Systems
Tomas-Rodriguez, Maria; Banks, Stephen P.
Paperback. A new technique for analysing and controlling nonlinear systems is introduced in this book. Although the methods outlined are novel, they can be simply implemented using pre-existing and widely known classical control ideas. Series: Lecture Notes in Control and Information Sciences. Num Pages: 312 pages, biography. BIC Classification: GPFC; PBU; PHS; TJFM. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 16. Weight in Grams: 980.
- Format
- Paperback
- Publication date
- 2010
- Publisher
- Springer London Ltd United Kingdom
- Number of pages
- 312
- Condition
- New
- SKU
- V9781849961004
- ISBN
- 9781849961004
Paperback
Condition: New
€ 197.62
€ 197.62
Hardback. This volume offers a new approach to teaching the fundamentals of semiconductor components based on the use of the accompanying process and device simulation software. Users are encouraged to augment their understanding by undertaking simulations and creating their own devices. Num Pages: 346 pages, Illustrations. BIC Classification: PHFC; TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 250 x 174 x 25. Weight in Grams: 744.
- Format
- Hardback
- Publication date
- 1999
- Publisher
- John Wiley & Sons Inc United Kingdom
- Edition
- 1st Edition
- Number of pages
- 346
- Condition
- New
- SKU
- V9780471988540
- ISBN
- 9780471988540
Hardback
Condition: New
€ 166.19
€ 166.19
Paperback. Num Pages: 330 pages, biography. BIC Classification: TJF; UYS. Category: (P) Professional & Vocational. Dimension: 279 x 210 x 18. Weight in Grams: 877.
- Format
- Paperback
- Publication date
- 2010
- Publisher
- Springer-Verlag New York Inc. United States
- Edition
- 2nd ed. Softcover of orig. ed. 1995
- Number of pages
- 330
- Condition
- New
- SKU
- V9781441947413
- ISBN
- 9781441947413
Paperback
Condition: New
€ 130.52
€ 130.52