×


 x 

Shopping cart

Electronics & communications engineering

Results 2641 - 2660 of 10256

Electronics & communications engineering

Paperback. Optical Burst Switching (OBS) offers a promising switching technique to support huge bandwidth requirements in optical backbone networks that use Wavelength Division Multiplexing. This book details the quality of service (QoS) issue in OBS networks. Series: Optical Networks. Num Pages: 198 pages, biography. BIC Classification: TJK. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 11. Weight in Grams: 305.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2007
Number of pages
198
Condition
New
SKU
V9781441941640
ISBN
9781441941640
Paperback
Condition: New

€ 122.33

Paperback. Num Pages: 178 pages, 1, black & white illustrations. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 10. Weight in Grams: 283.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2006
Number of pages
178
Condition
New
SKU
V9781441941961
ISBN
9781441941961
Paperback
Condition: New

€ 122.33

Paperback. This book proposes a linear two-port model for an N-stage modified-Greinacher full wave rectifier, predicting the overall conversion efficiency at low power levels. Includes a procedure for measuring how impedance modulation in the tag affects signal at the reader, and other useful tools. Num Pages: 148 pages, biography. BIC Classification: TJKR. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 8. Weight in Grams: 254.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2007
Number of pages
148
Condition
New
SKU
V9781441941992
ISBN
9781441941992
Paperback
Condition: New

€ 122.33

Paperback. Thin films and nanostructures play key roles in a sensor, including structural support, reliability enhancement, and transduction. These materials are discussed here in the context of transduction and how they contribute to today's sensor revolution. Editor(s): Zribi, Anis; Fortin, Jeffrey B. (Electronic Materials and Manufacturing Laboratory, Nisakyauna, New York, USA). Series: Integrated Analytical Systems. Num Pages: 214 pages, 100 black & white illustrations, biography. BIC Classification: TBN; TGMT; TJFD. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 12. Weight in Grams: 361.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2009
Number of pages
214
Condition
New
SKU
V9781441942111
ISBN
9781441942111
Paperback
Condition: New

€ 121.55

Paperback. This book presents formal testplanning guidelines with examples focused on creating assertion-based verification IP. It demonstrates a systematic process for formal specification and formal testplanning and is the first book published on this subject. Series: Integrated Circuits and Systems. Num Pages: 318 pages, biography. BIC Classification: TJ. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 17. Weight in Grams: 516.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2008
Number of pages
318
Condition
New
SKU
V9781441942180
ISBN
9781441942180
Paperback
Condition: New

€ 133.30

Paperback. Num Pages: 212 pages, biography. BIC Classification: TBD; TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 12. Weight in Grams: 361.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2007
Number of pages
212
Condition
New
SKU
V9781441942197
ISBN
9781441942197
Paperback
Condition: New

€ 185.77

Paperback. Compiled from industrial and academic lecture notes and reflecting years of experience in the development of silicon devices, this book covers both their theoretical and practical aspects, and how their electrical properties and processing conditions interact. Num Pages: 598 pages, 17 black & white tables, biography. BIC Classification: TGM; TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 31. Weight in Grams: 943.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2009
Number of pages
598
Condition
New
SKU
V9781441942241
ISBN
9781441942241
Paperback
Condition: New

€ 136.00

Paperback. Num Pages: 163 pages, biography. BIC Classification: TBC; TJFN; TTBL; UYS. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 8. Weight in Grams: 240.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2007
Number of pages
163
Condition
New
SKU
V9781441942265
ISBN
9781441942265
Paperback
Condition: New

€ 132.90

Paperback. Editor(s): Wood, Colin E.C.; Jena, Debdeep. Num Pages: 515 pages, biography. BIC Classification: PHFC; PNFS; TBC; TJFC; TJFD5. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 27. Weight in Grams: 807.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2008
Number of pages
515
Condition
New
SKU
V9781441942289
ISBN
9781441942289
Paperback
Condition: New

€ 219.73

Paperback. Provides an overview of the field of carbon nanotube electronics. This book covers materials and physical properties, synthesis and fabrication processes, devices and circuits, modeling, and finally novel applications of nanotube-based electronics. It introduces fundamental device physics and circuit concepts of 1-D electronics. Editor(s): Javey, Ali; Kong, Jing. Series: Integrated Circuits and Systems. Num Pages: 267 pages, 30 black & white illustrations, 10 black & white tables, biography. BIC Classification: TBN; TJFC; TJFD; UGC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 14. Weight in Grams: 397.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2009
Number of pages
267
Condition
New
SKU
V9781441942296
ISBN
9781441942296
Paperback
Condition: New

€ 132.90

Paperback. Editor(s): Lee, Hakho; Ham, Donhee; Westervelt, Robert M. Series: Integrated Circuits and Systems. Num Pages: 400 pages, biography. BIC Classification: TJ. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 21. Weight in Grams: 617.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2007
Number of pages
400
Condition
New
SKU
V9781441942302
ISBN
9781441942302
Paperback
Condition: New

€ 186.81

paperback. This book details all of most recent techniques in modern circuit placement and analyzes the optimality of these placement techniques. It provides significant amounts of analysis on each technique such as trade-offs between quality-of-results and runtime. Editor(s): Nam, Gi-Joon; Cong, Jason. Series: Integrated Circuits and Systems. Num Pages: 324 pages, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 18. Weight in Grams: 528.
Format
Paperback
Publication date
2010
Publisher
Springer/Sci-Tech/Trade United States
Edition
Softcover reprint of hardcover 1st ed. 2007
Number of pages
324
Condition
New
SKU
V9781441942319
ISBN
9781441942319
Paperback
Condition: New

€ 186.23

Paperback. Editor(s): Giambene, Giovanni. Num Pages: 338 pages, biography. BIC Classification: TJKS. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 19. Weight in Grams: 563.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2007
Number of pages
338
Condition
New
SKU
V9781441942357
ISBN
9781441942357
Paperback
Condition: New

€ 133.60

Paperback. This book addresses the difficulties of the optimization of complex systems. It does this via simulation models or other computation-intensive models involving possible stochastic effects and discrete choices. Num Pages: 317 pages, 50 black & white tables, biography. BIC Classification: KJT; PBU; TBC; TJFM; UGC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 17. Weight in Grams: 516.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2007
Number of pages
317
Condition
New
SKU
V9781441942432
ISBN
9781441942432
Paperback
Condition: New

€ 64.58

Paperback. Editor(s): Gharpurey, Ranjit; Kinget, Peter. Series: Integrated Circuits and Systems. Num Pages: 199 pages, 60 black & white illustrations, 15 black & white tables, biography. BIC Classification: TJ. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 11. Weight in Grams: 332.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2008
Number of pages
199
Condition
New
SKU
V9781441942463
ISBN
9781441942463
Paperback
Condition: New

€ 175.20

Paperback. The purpose of the book is to train verification engineers on the breadth of technologies available and to give them a utilitarian methodology for making effective use of those technologies. The book is easy to understand and a joy to read. Num Pages: 361 pages, 178 black & white illustrations, 33 black & white tables, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 20. Weight in Grams: 599.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2007
Number of pages
361
Condition
New
SKU
V9781441942555
ISBN
9781441942555
Paperback
Condition: New

€ 165.54

Paperback. Num Pages: 268 pages, biography. BIC Classification: TJK; UT. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 14. Weight in Grams: 433.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2007
Number of pages
268
Condition
New
SKU
V9781441942623
ISBN
9781441942623
Paperback
Condition: New

€ 164.62

Paperback. Investigates the issues required to ensure technology platforms capable of being seamlessly integrated into everyday objects. This title deals with the requirements for integrated computation and MEMs sensors, system-in-a-package solutions, and multi-chip modules. Editor(s): Delaney, Kieran. Series: Microsystems. Num Pages: 422 pages, 9 black & white tables, biography. BIC Classification: TBC; TGM; TJF; UYQ. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 22. Weight in Grams: 664.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Number of pages
422
Condition
New
SKU
V9781441942777
ISBN
9781441942777
Paperback
Condition: New

€ 187.09

paperback. Series: Frontiers in Electronic Testing. Num Pages: 349 pages, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 18. Weight in Grams: 539.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of hardcover 2nd ed. 2007
Number of pages
349
Condition
New
SKU
V9781441942852
ISBN
9781441942852
Paperback
Condition: New

€ 239.19

Paperback. Satellite Communications and Navigation Systems publishes the proceedings of the 2006 Tyrrhenian International Workshop on Digital Communications. The book focuses on the integration of communication and navigation systems in satellites. Editor(s): Re, Enrico Del; Ruggieri, Marina. Series: Signals and Communication Technology. Num Pages: 768 pages, biography. BIC Classification: TJKS. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 39. Weight in Grams: 1187.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of hardcover 1st ed. 2008
Number of pages
768
Condition
New
SKU
V9781441942920
ISBN
9781441942920
Paperback
Condition: New

€ 357.25

Subscribe to our newsletter

News on special offers, signed editions & more!