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Electronics & communications engineering
Results 10681 - 10700 of 10896
Electronics & communications engineering
Paperback. Series: Springer Series in Optical Sciences. Num Pages: 412 pages, 48 black & white illustrations, 101 colour illustrations, 20 black & white tables, biogra. BIC Classification: TJK; TTB. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 22. Weight in Grams: 635.
- Format
- Paperback
- Publication date
- 2016
- Publisher
- Springer-Verlag New York Inc. United States
- Edition
- Softcover reprint of the original 1st ed. 2015
- Number of pages
- 412
- Condition
- New
- SKU
- V9781493952748
- ISBN
- 9781493952748
Paperback
Condition: New
€ 194.98
€ 194.98
Hardcover. This book provides the advanced issues of FPGA design as the underlying theme of the work. In practice, an engineer typically needs to be mentored for several years before these principles are appropriately utilized. The topics that will be discussed in this book are essential to designing FPGA's beyond moderate complexity. Num Pages: 352 pages, , black & white illustrations. BIC Classification: TJ. Category: (P) Professional & Vocational. Dimension: 243 x 164 x 26. Weight in Grams: 632.
- Format
- Hardback
- Publication date
- 2007
- Publisher
- John Wiley & Sons Inc United Kingdom
- Edition
- 1st Edition
- Number of pages
- 352
- Condition
- New
- SKU
- V9780470054376
- ISBN
- 9780470054376
Hardback
Condition: New
€ 150.90
€ 150.90
Paperback. Editor(s): Demchenko, Alexander P. Series: Springer Series on Fluorescence. Num Pages: 362 pages, biography. BIC Classification: MBGR; PHVN; PNF; PSB; TJFD. Category: (G) General (US: Trade). Dimension: 235 x 155 x 19. Weight in Grams: 557.
- Format
- Paperback
- Publication date
- 2014
- Publisher
- Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
- Number of pages
- 362
- Condition
- New
- SKU
- V9783642267642
- ISBN
- 9783642267642
Paperback
Condition: New
€ 371.58
€ 371.58
Paperback. With contributions by numerous experts Editor(s): Demchenko, A. P. Series: Springer Series on Fluorescence. Num Pages: 462 pages, 117 black & white illustrations, 106 colour illustrations, biography. BIC Classification: MBGR; PHVN; PNF; PSB; TJFD. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 28. Weight in Grams: 718.
- Format
- Paperback
- Publication date
- 2012
- Publisher
- Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
- Number of pages
- 462
- Condition
- New
- SKU
- V9783642264771
- ISBN
- 9783642264771
Paperback
Condition: New
€ 372.63
€ 372.63
Paperback. With contributions by numerous experts Editor(s): Demchenko, Alexander. Series: Springer Series on Fluorescence. Num Pages: 400 pages, 153 black & white illustrations, 56 colour illustrations, biography. BIC Classification: MBGR; PHVN; PNF; PSB; TJFD. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 23. Weight in Grams: 611.
- Format
- Paperback
- Publication date
- 2012
- Publisher
- Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
- Number of pages
- 400
- Condition
- New
- SKU
- V9783642264719
- ISBN
- 9783642264719
Paperback
Condition: New
€ 371.93
€ 371.93
hardcover. Editor(s): Demchenko, A. P. Series: Springer Series on Fluorescence. Num Pages: 362 pages, biography. BIC Classification: PHVN; PNFS; PSA; TJFD. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 23. Weight in Grams: 707.
- Format
- Hardback
- Publication date
- 2011
- Publisher
- Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
- Edition
- 2011th Edition
- Number of pages
- 362
- Condition
- New
- SKU
- V9783642180347
- ISBN
- 9783642180347
Hardback
Condition: New
€ 372.60
€ 372.60
Hardcover. Flip chip packaging is used in computing, communications, consumer and automotive electronics. This book discusses past, present and future advances in flip chip packaging, covering trends in substrate technology, material development and assembly processes. Editor(s): Tong, Ho-Ming; Lai, Yi-Shao; Wong, C. P. Num Pages: 560 pages, 171 black & white illustrations, 242 colour illustrations, 37 black & white tables. BIC Classification: TJF; TJFC; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 243 x 162 x 26. Weight in Grams: 922.
- Format
- Hardback
- Publication date
- 2013
- Publisher
- Springer-Verlag New York Inc. United States
- Edition
- 2013th Edition
- Number of pages
- 500
- Condition
- New
- SKU
- V9781441957672
- ISBN
- 9781441957672
Hardback
Condition: New
€ 254.23
€ 254.23
Advanced Electronic Technologies and Systems Based on Low-Dimensional ...
. Ed(S): Balkanski, Minko; Andreev, N.A.
Paperback. Proceedings of the NATO Advanced Study Institute, Sozopol, Bulgaria, 18-28 September 1996 Editor(s): Balkanski, Minko; Andreev, N.A. Series: NATO Science Partnership Subseries: 3. Num Pages: 312 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 16. Weight in Grams: 486.
- Format
- Paperback
- Publication date
- 2010
- Publisher
- Springer Netherlands
- Edition
- 1st ed. Softcover of orig. ed. 1998
- Number of pages
- 312
- Condition
- New
- SKU
- V9789048149643
- ISBN
- 9789048149643
Paperback
Condition: New
€ 249.64
€ 249.64
Advanced Electronic Technologies and Systems Based on Low-Dimensional ...
. Ed(S): Balkanski, Minko; Andreev, N.A.
Hardback. Proceedings of the NATO Advanced Study Institute, Sozopol, Bulgaria, 18-28 September 1996 Editor(s): Balkanski, Minko; Andreev, N.A. Series: NATO Science Partnership Subseries: 3. Num Pages: 312 pages, biography. BIC Classification: TJFD5; TTB; UK. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 19. Weight in Grams: 620.
- Format
- Hardback
- Publication date
- 1997
- Publisher
- Kluwer Academic Publishers United States
- Number of pages
- 312
- Condition
- New
- SKU
- V9780792348757
- ISBN
- 9780792348757
Hardback
Condition: New
€ 255.37
€ 255.37
Hardcover. This book updates the book, Advanced Electronic Packaging: With Emphasis on Multichip Modules, Ed.W.D. Brown, IEEE Press, copyright 1999. The original edition of the book has been widely adopted by industry and has been and is still being adopted by universities for graduate courses. Editor(s): Ulrich, Richard K.; Brown, William D. Series: IEEE Press Series on Microelectronic Systems. Num Pages: 840 pages, illustrations. BIC Classification: TJ. Category: (P) Professional & Vocational. Dimension: 190 x 264 x 51. Weight in Grams: 1728.
- Format
- Hardback
- Publication date
- 2006
- Publisher
- John Wiley and Sons Ltd United Kingdom
- Edition
- 2nd Edition
- Number of pages
- 840
- Condition
- New
- SKU
- V9780471466093
- ISBN
- 9780471466093
Hardback
Condition: New
€ 213.33
€ 213.33
Hardback. Editor(s): Sina, Barkeshli; Khorasani, Sina. Num Pages: 375 pages, 129 black & white illustrations, 6 colour illustrations, biography. BIC Classification: PHJ; PHK; TJFN. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 22. Weight in Grams: 725.
- Format
- Hardback
- Publication date
- 2014
- Publisher
- Springer International Publishing AG Switzerland
- Number of pages
- 375
- Condition
- New
- SKU
- V9783319115467
- ISBN
- 9783319115467
Hardback
Condition: New
€ 129.56
€ 129.56
hardcover. Editor(s): Tiwari, Ashutosh; Kuralay, Filiz; Uzun, Lokman. Series: Advanced Material Series. Num Pages: 544 pages. BIC Classification: TGM; TJF. Category: (P) Professional & Vocational. Dimension: 238 x 159 x 33. Weight in Grams: 834.
- Format
- Hardback
- Publication date
- 2016
- Publisher
- John Wiley & Sons Inc United States
- Number of pages
- 544
- Condition
- New
- Edition
- 1st Edition
- SKU
- V9781119242529
- ISBN
- 9781119242529
Hardback
Condition: New
€ 252.83
€ 252.83
Hardcover. Series Editor(s): Tiwari, Ashutosh. Series: Advanced Material Series. Num Pages: 760 pages, illustrations. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 244 x 163 x 45. Weight in Grams: 1184.
- Format
- Hardback
- Publication date
- 2015
- Publisher
- John Wiley & Sons Inc United States
- Number of pages
- 760
- Condition
- New
- Edition
- 1st Edition
- SKU
- V9781118998359
- ISBN
- 9781118998359
Hardback
Condition: New
€ 196.77
€ 196.77
Hardback. 2010 First International Conference on Electrical and Electronics Engineering was held in Wuhan, China December 4-5. This book contains 72 revised and extended research articles written by prominent researchers participating in the conference. Editor(s): Lee, Jian. Series: Lecture Notes in Electrical Engineering. Num Pages: 739 pages, biography. BIC Classification: THR; TJF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 33. Weight in Grams: 1266.
- Format
- Hardback
- Publication date
- 2011
- Publisher
- Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
- Number of pages
- 739
- Condition
- New
- SKU
- V9783642197116
- ISBN
- 9783642197116
Hardback
Condition: New
€ 376.26
€ 376.26
Hardback. Here is a thorough survey of new physical leakages of embedded systems, namely power and electromagnetic emanations. Discusses such advanced statistical methods to attack embedded devices as high-order attack, template attack in principal subspaces and more. Num Pages: 139 pages, 3 black & white tables, biography. BIC Classification: TJF; TJFC; UMB; UR. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 15. Weight in Grams: 403.
- Format
- Hardback
- Publication date
- 2013
- Publisher
- Springer-Verlag New York Inc. United States
- Number of pages
- 139
- Condition
- New
- SKU
- V9781461467823
- ISBN
- 9781461467823
Hardback
Condition: New
€ 127.13
€ 127.13
Hardback. Series: Studies in Systems, Decision and Control. Num Pages: 236 pages, 4 black & white illustrations, 122 colour illustrations, biography. BIC Classification: GPFC; TBJ; TJFM; UYQ. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 14. Weight in Grams: 520.
- Format
- Hardback
- Publication date
- 2015
- Publisher
- Springer Verlag, Singapore Singapore
- Number of pages
- 236
- Condition
- New
- SKU
- V9789812874771
- ISBN
- 9789812874771
Hardback
Condition: New
€ 128.17
€ 128.17
Hardcover. Digital signal processing plays a central role in the development of modern communication and information processing systems. The theory and application of signal processing is concerned with the identification, modelling and utilisation of patterns and structures in a signal process. Num Pages: 544 pages, Illustrations. BIC Classification: TJK. Category: (P) Professional & Vocational. Dimension: 177 x 254 x 36. Weight in Grams: 1044.
- Format
- Hardback
- Publication date
- 2009
- Publisher
- John Wiley & Sons Inc United Kingdom
- Edition
- 4th Edition
- Number of pages
- 544
- Condition
- New
- SKU
- V9780470754061
- ISBN
- 9780470754061
Hardback
Condition: New
€ 148.35
€ 148.35
Paperback. Advances in synthesis and characterization of dielectric, piezoelectric and ferroelectric thin films are included in this volume. Dielectric, piezoelectric and ferroelectric thin films have a tremendous impact on a variety of commercial and military systems including tunable microwave devices, memories, MEMS devices, actuators and sensors. Editor(s): Tuttle, Bruce A.; Chen, Chonglin; Jia, Quanxi; Ramesh, R. Series: Ceramic Transactions. Num Pages: 86 pages, Illustrations. BIC Classification: TJFD5. Category: (UP) Postgraduate, Research & Scholarly. Dimension: 231 x 156 x 6. Weight in Grams: 164.
- Format
- Paperback
- Publication date
- 2005
- Publisher
- American Ceramic Society United States
- Edition
- 1st Edition
- Number of pages
- 86
- Condition
- New
- SKU
- V9781574981834
- ISBN
- 9781574981834
Paperback
Condition: New
€ 144.52
€ 144.52
Hardcover. Provides the knowledge and skills to design and realize microwave and RF filters Covers numerous approaches for solving the filter design problem. Based on the research performed by the authors for leading French and European Space and Telecommunication agencies over a period of 30 years. Num Pages: 354 pages, Illustrations. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 238 x 152 x 22. Weight in Grams: 642.
- Format
- Hardback
- Publication date
- 2008
- Publisher
- John Wiley and Sons Ltd United Kingdom
- Edition
- 1st Edition
- Number of pages
- 354
- Condition
- New
- SKU
- V9780470183106
- ISBN
- 9780470183106
Hardback
Condition: New
€ 176.39
€ 176.39
Paperback. The STandard for Exchange of Product model, or STEP, offers a complete computer-interpretable product data format. This volume covers recent research results, and a range of STEP and STEP-NC application case studies from the fields of design and manufacturing. Editor(s): Xu, Xun; Nee, Andrew Yeh Ching. Series: Springer Series in Advanced Manufacturing. Num Pages: 505 pages, 52 black & white tables, biography. BIC Classification: AKP; TBD; TJFM1; UGC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 25. Weight in Grams: 771.
- Publisher
- Springer London Ltd
- Format
- Paperback
- Publication date
- 2012
- Edition
- 2010th Edition
- Condition
- New
- SKU
- V9781447125204
- ISBN
- 9781447125204
Paperback
Condition: New
€ 251.53
€ 251.53