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Electronics & communications engineering

Results 2761 - 2780 of 11090

Electronics & communications engineering

Hardback. Num Pages: 167 pages, 48 black & white illustrations, biography. BIC Classification: TGPR; TJFD. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 11. Weight in Grams: 421.
Format
Hardback
Publication date
2014
Publisher
Springer International Publishing AG Switzerland
Number of pages
167
Condition
New
SKU
V9783319091105
ISBN
9783319091105
Hardback
Condition: New

€ 121.99

Paperback. Num Pages: 167 pages, 48 black & white illustrations, biography. BIC Classification: TGPR; TJF; TJFD. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 9. Weight in Grams: 267.
Format
Paperback
Publication date
2016
Publisher
Springer International Publishing AG Switzerland
Edition
Softcover reprint of the original 1st ed. 2015
Number of pages
167
Condition
New
SKU
V9783319361680
ISBN
9783319361680
Paperback
Condition: New

€ 121.01

Hardcover. Provides presentations of techniques used for solving quality and reliability problems in telecommunications networks replete with illustrations of their applications to real-world services and world class events. Editor(s): Stavroulakis, Peter. Num Pages: 370 pages, Illustrations. BIC Classification: KJMP; TJK. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 252 x 173 x 25. Weight in Grams: 754.
Format
Hardback
Publication date
2002
Publisher
John Wiley & Sons Inc United Kingdom
Edition
1st Edition
Number of pages
370
Condition
New
SKU
V9780470847701
ISBN
9780470847701
Hardback
Condition: New

€ 269.25

Paperback. This book examines issues related to the test, diagnosis and fault-tolerance of Network on Chip-based systems. It provides research on the challenges to test, diagnose and tolerate faults in NoC-based systems and includes numerous test strategies. Num Pages: 222 pages, 13 black & white tables, biography. BIC Classification: TJFC; UGC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 12. Weight in Grams: 349.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
222
Condition
New
SKU
V9781489973504
ISBN
9781489973504
Paperback
Condition: New

€ 133.13

Hardback. This book examines issues related to the test, diagnosis and fault-tolerance of Network on Chip-based systems. It provides research on the challenges to test, diagnose and tolerate faults in NoC-based systems and includes numerous test strategies. Num Pages: 209 pages, 13 black & white tables, biography. BIC Classification: TJFC; UKN. Category: (P) Professional & Vocational. Dimension: 241 x 165 x 19. Weight in Grams: 484.
Format
Hardback
Publication date
2011
Publisher
Springer-Verlag New York Inc. United States
Edition
2012
Number of pages
209
Condition
New
SKU
V9781461407904
ISBN
9781461407904
Hardback
Condition: New

€ 121.88

Hardcover. This invaluable resource tells the complete story of failure mechanisms from basic concepts to the tools necessary to conduct reliability tests and analyze the results. Both a text and a reference work for this important area of semiconductor technology, it assumes no reliability education or experience. Series: IEEE Press Series on Microelectronic Systems. Num Pages: 624 pages, Illustrations. BIC Classification: TJFC; UY. Category: (P) Professional & Vocational. Dimension: 235 x 162 x 34. Weight in Grams: 982.
Format
Hardback
Publication date
2009
Publisher
John Wiley and Sons Ltd United Kingdom
Edition
1st Edition
Number of pages
624
Condition
New
SKU
V9780471731726
ISBN
9780471731726
Hardback
Condition: New

€ 210.65

Paperback. This book provides critically important information for designing and building reliable cost-effective products. It includes numerous example problems with solutions. Num Pages: 415 pages, 58 black & white tables, 5 colour tables, biography. BIC Classification: PBT; TGPR; TH; TJF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 22. Weight in Grams: 635.
Publisher
Springer International Publishing AG
Format
Paperback
Publication date
2015
Edition
2nd ed. 2013
Condition
New
SKU
V9783319033297
ISBN
9783319033297
Paperback
Condition: New

€ 112.25

Paperback. Presents the findings of COST 246 (1993-1998) - European research initiative in the field of optical telecommunications. This title covers topics such as: lifetime estimation; failure mechanisms; ageing test methods; and, field data and service environments for components. Editor(s): Volotinen, Tarja; Griffioen, Willem; Gadonna, Michel; Limberger, Hans G. Num Pages: 443 pages, biography. BIC Classification: TJK; TTBF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 23. Weight in Grams: 1380.
Format
Paperback
Publication date
1999
Publisher
Springer London Ltd United Kingdom
Edition
Softcover reprint of the original 1st ed. 1999
Number of pages
443
Condition
New
SKU
V9781852331474
ISBN
9781852331474
Paperback
Condition: New

€ 190.99

hardcover. Provides a general overview of reliability, faults, fault models, nanotechnology, nanodevices, fault-tolerant architectures and reliability evaluation techniques. Num Pages: 195 pages, biography. BIC Classification: TGPQ; TJFC; UGC. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 18. Weight in Grams: 502.
Format
Hardback
Publication date
2010
Publisher
Springer United States
Edition
2011th Edition
Number of pages
195
Condition
New
SKU
V9781441962164
ISBN
9781441962164
Hardback
Condition: New

€ 122.67

Paperback. Num Pages: 222 pages, biography. BIC Classification: TGPR; TJFC; UGC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 12. Weight in Grams: 349.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
222
Condition
New
SKU
V9781489982544
ISBN
9781489982544
Paperback
Condition: New

€ 121.88

paperback. This text discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. It covers many topics, and it addresses specific failure modes in solder and conductive adhesives at great length. Num Pages: 217 pages, 50 black & white tables, biography. BIC Classification: TDPB; TGPR; TJF; TJFD. Category: (G) General (US: Trade). Dimension: 235 x 155 x 12. Weight in Grams: 343.
Format
Paperback
Publication date
2014
Publisher
Springer United States
Edition
2011th Edition
Number of pages
217
Condition
New
SKU
V9781489982117
ISBN
9781489982117
Paperback
Condition: New

€ 185.77

hardcover. This text discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. It covers many topics, and it addresses specific failure modes in solder and conductive adhesives at great length. Num Pages: 217 pages, 50 black & white tables, biography. BIC Classification: TDPB; TGPR; TJF. Category: (P) Professional & Vocational. Dimension: 238 x 160 x 19. Weight in Grams: 490.
Format
Hardback
Publication date
2011
Publisher
Springer United States
Edition
2011th Edition
Number of pages
217
Condition
New
SKU
V9781441957597
ISBN
9781441957597
Hardback
Condition: New

€ 189.73

Paperback. Num Pages: 509 pages, 105 black & white tables, biography. BIC Classification: TGPQ; TJF. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 28. Weight in Grams: 842.
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Edition
Softcover reprint of the original 1st ed. 1999
Number of pages
509
Condition
New
SKU
V9783642636257
ISBN
9783642636257
Paperback
Condition: New

€ 135.37

Paperback. Num Pages: 469 pages, biography. BIC Classification: THR; TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 24. Weight in Grams: 657.
Format
Paperback
Publication date
2013
Publisher
Springer-Verlag New York Inc. United States
Edition
2nd ed. 1992. Softcover reprint of the original 2
Number of pages
469
Condition
New
SKU
V9781489906878
ISBN
9781489906878
Paperback
Condition: New

€ 304.28

Hardback. Provides coverage of fault trees and a more complete examination of probability distribution. Num Pages: 469 pages, biography. BIC Classification: TGPR; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 243 x 157 x 31. Weight in Grams: 822.
Format
Hardback
Publication date
1992
Publisher
Springer Science+Business Media United States
Edition
2nd ed. 1992
Number of pages
469
Condition
New
SKU
V9780306440632
ISBN
9780306440632
Hardback
Condition: New

€ 310.10

Hardcover. This book shows how to build in, evaluate, and demonstrate reliability and availability of components, equipment, systems. It features checklists for design reviews and more than 100 practice oriented examples. Num Pages: 650 pages, biography. BIC Classification: KJMV6; KJU; TJF. Category: (P) Professional & Vocational. Dimension: 235 x 155. .
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Number of pages
650
Format
Hardback
Publication date
2017
Edition
8th ed. 2017
Condition
New
SKU
V9783662542088
ISBN
9783662542088
Hardback
Condition: New

€ 326.47

Hardcover. An Integrated Approach to Product Development Reliability Engineering presents an integrated approach to the design, engineering, and management of reliability activities throughout the life cycle of a product, including concept, research and development, design, manufacturing, assembly, sales, and service. Series: Wiley Series in Systems Engineering and Management. Num Pages: 512 pages, colour illustrations, colour tables, figures, graphs. BIC Classification: THX; TJ. Category: (P) Professional & Vocational. Dimension: 261 x 178 x 30. Weight in Grams: 1210.
Publisher
John Wiley & Sons Inc United States
Number of pages
480
Format
Hardback
Publication date
2014
Edition
1st Edition
Condition
New
SKU
V9781118140673
ISBN
9781118140673
Hardback
Condition: New

€ 156.27

Paperback. Here is comprehensive coverage of reliability issues and their countermeasures in large-scale digital control systems, from the hardware and software in digital systems to the human operators who supervise the overall process of large-scale systems. Editor(s): Seong, Poong Hyun. Series: Springer Series in Reliability Engineering. Num Pages: 304 pages, 36 black & white tables, biography. BIC Classification: TBC; TGPQ; THK; TJFM; UYD. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 17. Weight in Grams: 462.
Format
Paperback
Publication date
2010
Publisher
Springer London Ltd United Kingdom
Edition
1st ed. Softcover of orig. ed. 2009
Number of pages
304
Condition
New
SKU
V9781849967976
ISBN
9781849967976
Paperback
Condition: New

€ 237.40

Hardback. Here is comprehensive coverage of reliability issues and their countermeasures in large-scale digital control systems, from the hardware and software in digital systems to the human operators who supervise the overall process of large-scale systems. Editor(s): Seong, Poong Hyun. Series: Springer Series in Reliability Engineering. Num Pages: 304 pages, 36 black & white tables, biography. BIC Classification: TJFM; UB. Category: (P) Professional & Vocational. Dimension: 243 x 166 x 24. Weight in Grams: 576.
Format
Hardback
Publication date
2008
Publisher
Springer London Ltd United Kingdom
Number of pages
304
Condition
New
SKU
V9781848003835
ISBN
9781848003835
Hardback
Condition: New

€ 243.56

Paperback. Series: SpringerBriefs in Electrical and Computer Engineering. Num Pages: 68 pages, 6 black & white illustrations, 5 colour illustrations, biography. BIC Classification: TGPR; TJF; TTBM; UYQV. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 4. Weight in Grams: 134.
Format
Paperback
Publication date
2014
Publisher
Springer International Publishing AG Switzerland
Number of pages
68
Condition
New
SKU
V9783319133164
ISBN
9783319133164
Paperback
Condition: New

€ 69.32

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