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Electronics & communications engineering

Results 3241 - 3245 of 3245

Electronics & communications engineering

Hardback. The use of 3D cameras and video-based modeling by the film industry have induced a booming of interest for 3D acquisition technology, 3D content, and 3D displays. 3D Video provides elements to understand the underlying computer-based science of these technologies, stepping away from traditional 3D vision. Editor(s): Lucas, Laurent; Loscos, Celine; Remion, Yannick. Num Pages: 480 pages, illustrations. BIC Classification: TJKV. Category: (P) Professional & Vocational. Dimension: 232 x 162 x 32. Weight in Grams: 850.
Format
Hardback
Publication date
2013
Publisher
ISTE Ltd and John Wiley & Sons Inc United Kingdom
Number of pages
480
Condition
New
SKU
V9781848215078
ISBN
9781848215078
Hardback
Condition: New

€ 182.71

Hardcover. The arrival, and continuing evolution, of high quality 3D objects has been made possible by recent progress in 3D scanner acquisition and 3D graphics rendering. With this increasing quality comes a corresponding increase in the size and complexity of the data files and the necessity for advances in compression techniques. Editor(s): Dugelay, Jean-Luc; Baskurt, Atilla; Daoudi, Mohamed. Num Pages: 210 pages, Illustrations. BIC Classification: TJF; UYT. Category: (P) Professional & Vocational. Dimension: 231 x 161 x 17. Weight in Grams: 436.
Format
Hardback
Publication date
2008
Publisher
John Wiley and Sons Ltd United Kingdom
Edition
1st Edition
Number of pages
210
Condition
New
SKU
V9780470065426
ISBN
9780470065426
Hardback
Condition: New

€ 138.15

Hardback. 3-Dimensional VLSI presents a new integration scheme designed for problems that are difficult to solve with traditional non-monolithic integration schemes. Major 3-D VLSI design issues are also introduced, within an integrated framework. Num Pages: 200 pages, 50 black & white illustrations, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 243 x 157 x 16. Weight in Grams: 456.
Format
Hardback
Publication date
2010
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Number of pages
200
Condition
New
SKU
V9783642041563
ISBN
9783642041563
Hardback
Condition: New

€ 193.21

Paperback. Offers a diagram-packed timesaver to help you master several types of problem you'll face on tests. This book contains problems that cover every area of electric circuits, from basic units to complex multi-phase circuits, two-port networks, and the use of Laplace transforms. Series: Schaum's Solved Problems Series. Num Pages: 768 pages, Illustrations. BIC Classification: TJFC. Category: (U) Tertiary Education (US: College). Dimension: 273 x 208 x 32. Weight in Grams: 1740.
Publisher
McGraw-Hill Education - Europe United States
Number of pages
768
Format
Paperback
Publication date
1988
Edition
Reissue
Condition
New
SKU
V9780070459366
ISBN
9780070459366
Paperback
Condition: New

€ 51.81
€ 40.99

Paperback. Presents an overview of the design project and beyond for various engineering disciplines, including sections on how to protect intellectual property rights and suggestions for turning the project into a business. This work shows the questions with a set of guidelines for the process. It also presents two sample project reports and presentations. Editor(s): Bystrom, Maja; Eisenstein, Bruce. Num Pages: 294 pages, 101 black & white illustrations, 30 black & white tables. BIC Classification: P; TBC; THR; TJF; UMZ. Category: (G) General (US: Trade); (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 254 x 178 x 17. Weight in Grams: 531.
Format
Paperback
Publication date
2005
Publisher
Practical Engineering Design United States
Number of pages
294
Condition
New
Edition
1st Edition
SKU
V9780824723217
ISBN
9780824723217
Paperback
Condition: New

€ 136.95

Page 163 of 163

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