×


 x 

Shopping cart

Electronics & communications engineering

Results 341 - 360 of 11682

Electronics & communications engineering

Hardback. A critical step in the design of a DSP system is to identify for each of its components (DSP kernels) an implementation architecture that provides the desired degree of flexibility/programmability and optimises the area-delay-power parameters. This book covers the entire solution space comprising hardware multiplier-based. Num Pages: 210 pages, biography. BIC Classification: TJF; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 14. Weight in Grams: 520.
Format
Hardback
Publication date
2001
Publisher
Kluwer Academic Publishers United States
Number of pages
210
Condition
New
SKU
V9780792374213
ISBN
9780792374213
Hardback
Condition: New

€ 198.67

Paperback. Num Pages: 210 pages, biography. BIC Classification: TJFC; UGC. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 12. Weight in Grams: 367.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2001
Number of pages
210
Condition
New
SKU
V9781441949042
ISBN
9781441949042
Paperback
Condition: New

€ 194.05

Paperback. Editor(s): Birtwistle, Graham; Subrahmanyam, P. A. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 404 pages, 1 black & white illustrations, biography. BIC Classification: THR; TJFC; UMA. Category: (G) General (US: Trade). Dimension: 235 x 155 x 22. Weight in Grams: 640.
Format
Paperback
Publication date
2013
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of the original 1st ed. 1987
Number of pages
404
Condition
New
SKU
V9781461291978
ISBN
9781461291978
Paperback
Condition: New

€ 128.96

paperback. Editor(s): Bayoumi, Magdy; Swartzlander, Earl E. Num Pages: 234 pages, biography. BIC Classification: THR; TJFC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 13. Weight in Grams: 391.
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of the original 1st ed. 1994
Number of pages
234
Condition
New
SKU
V9781461361992
ISBN
9781461361992
Paperback
Condition: New

€ 127.30

Paperback. Series: Monographs in Computer Science. Num Pages: 201 pages, biography. BIC Classification: TJF; UMX; UYF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 11. Weight in Grams: 323.
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of the original 1st ed. 1989
Number of pages
201
Condition
New
SKU
V9781461396604
ISBN
9781461396604
Paperback
Condition: New

€ 66.06

Hardback. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 278 pages, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 19. Weight in Grams: 609.
Format
Hardback
Publication date
1988
Publisher
Kluwer Academic Publishers United States
Number of pages
278
Condition
New
SKU
V9780898382815
ISBN
9780898382815
Hardback
Condition: New

€ 199.99

Paperback. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 278 pages, biography. BIC Classification: THR; TJFC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 17. Weight in Grams: 474.
Format
Paperback
Publication date
2011
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of the original 1st ed. 1988
Number of pages
278
Condition
New
SKU
V9781461289579
ISBN
9781461289579
Paperback
Condition: New

€ 194.17

Paperback. LSI Physical Design explores how algorthims can be used to create a geometric chip layout can be created from an abstract circuit design. The text emphasizes essential, fundamental techniques, ranging from hypergraph partictioning and circuit placement to timing closure. Num Pages: 321 pages, biography. BIC Classification: TJF; TJFC; UGC; UYF. Category: (G) General (US: Trade). Dimension: 236 x 155 x 23. Weight in Grams: 484.
Format
Paperback
Publication date
2014
Publisher
Springer Netherlands
Number of pages
321
Condition
New
SKU
V9789400790209
ISBN
9789400790209
Paperback
Condition: New

€ 105.97

Paperback. Series: Springer Series in Advanced Microelectronics. Num Pages: 506 pages, 26 black & white tables, biography. BIC Classification: TJFD1; TJFD5; UY. Category: (P) Professional & Vocational. Dimension: 234 x 157 x 28. Weight in Grams: 771.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Edition
Softcover reprint of hardcover 1st ed. 2001
Number of pages
506
Condition
New
SKU
V9783642087363
ISBN
9783642087363
Paperback
Condition: New

€ 262.46

Hardback. A description of microelectronic device design. It covers the topics ranging from the basics to low-power and ultralow-voltage designs, subthreshold current reduction, memory subsystem designs for modern DRAMs, and various on-chip supply-voltage conversion techniques. Series: Springer Series in Advanced Microelectronics. Num Pages: 506 pages, 26 black & white tables, biography. BIC Classification: TJFD1; TJFD5; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 166 x 248 x 26. Weight in Grams: 832.
Format
Hardback
Publication date
2001
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Number of pages
506
Condition
New
SKU
V9783540678205
ISBN
9783540678205
Hardback
Condition: New

€ 292.51

Paperback. VLSI for Wireless Communication, Second Edition, takes a system approach to its subject, starting with an overview of the most up to date wireless systems and the transceiver architecture available. Each chapter includes at least one complete design example. Num Pages: 546 pages, biography. BIC Classification: TJKW. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 29. Weight in Grams: 866.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Edition
2nd ed. 2011
Number of pages
546
Condition
New
SKU
V9781489973771
ISBN
9781489973771
Paperback
Condition: New

€ 69.70

Hardback. VLSI for Wireless Communication, Second Edition, takes a system approach to its subject, starting with an overview of the most up to date wireless systems and the transceiver architecture available. Each chapter includes at least one complete design example. Num Pages: 572 pages, biography. BIC Classification: TJKW. Category: (P) Professional & Vocational. Dimension: 241 x 164 x 35. Weight in Grams: 978. 572 pages, 1, black & white illustrations. VLSI for Wireless Communication, Second Edition, takes a system approach to its subject, starting with an overview of the most up to date wireless systems and the transceiver architecture available. Each chapter includes at least one complete design example. Cateogry: (P) Professional & Vocational. BIC Classification: TJKW. Dimension: 241 x 164 x 35. Weight: 978.
Publisher
Springer-Verlag New York Inc.
Number of pages
400
Format
Hardback
Publication date
2011
Edition
2012th Edition
Condition
New
SKU
V9781461409854
ISBN
9781461409854
Hardback
Condition: New

€ 70.70

Paperback. Editor(s): Fu, K. S. Series: Springer Series in Information Sciences. Num Pages: 236 pages, biography. BIC Classification: TJF; UYQP; UYT. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 13. Weight in Grams: 387.
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Edition
Softcover reprint of the original 1st ed. 1984
Number of pages
236
Condition
New
SKU
V9783642475276
ISBN
9783642475276
Paperback
Condition: New

€ 66.52

Hardback. Editor(s): Delgado-Frias, Jose G.; Moore, Will. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 274 pages, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 17. Weight in Grams: 586.
Format
Hardback
Publication date
1989
Publisher
Kluwer Academic Publishers United States
Number of pages
274
Condition
New
SKU
V9780792390008
ISBN
9780792390008
Hardback
Condition: New

€ 133.34

Paperback. Editor(s): Delgado-Frias, Jose G.; Moore, Will. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 274 pages, biography. BIC Classification: THR; TJFC; UYF; UYQ. Category: (G) General (US: Trade). Dimension: 235 x 155 x 15. Weight in Grams: 450.
Format
Paperback
Publication date
2011
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of the original 1st ed. 1989
Number of pages
274
Condition
New
SKU
V9781461288954
ISBN
9781461288954
Paperback
Condition: New

€ 127.70

Hardcover. Integrating discussion of elemental (silicon) and compound (gallium arsenide) technologies, this monograph explains why the two materials are particularly suited to Very Large Scale Integrated (VLSI) schemes. The fabrication principles for circuits such as CMOS, MOS and PET are emphasized. Num Pages: 864 pages, Illustrations. BIC Classification: TGM; TJFC; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 240 x 163 x 44. Weight in Grams: 1292.
Format
Hardback
Publication date
1994
Publisher
John Wiley and Sons Ltd United States
Edition
2nd Edition
Number of pages
864
Condition
New
SKU
V9780471580058
ISBN
9780471580058
Hardback
Condition: New

€ 222.25

Hardback. Expertly combining the fields of computer architecture theory and digital signal processing (DSP), this comprehensive, single-volume resource provides everything circuit designers and computer professionals need to stay on top of the rapid changes in VLSI (Very Large Scale Integration) design for DSP. Num Pages: 808 pages, Illustrations. BIC Classification: TJK; UYF; UYS; UYT. Category: (UP) Postgraduate, Research & Scholarly. Dimension: 240 x 160 x 42. Weight in Grams: 1186.
Format
Hardback
Publication date
1999
Publisher
John Wiley and Sons Ltd United States
Number of pages
808
Condition
New
SKU
V9780471241867
ISBN
9780471241867
Hardback
Condition: New

€ 206.97

Paperback. Editor(s): Ramacher, Ulrich; Ruckert, Ulrich. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 343 pages, biography. BIC Classification: THR; TJFC; TTBM; UY. Category: (P) Professional & Vocational. Dimension: 240 x 160 x 19. Weight in Grams: 574.
Format
Paperback
Publication date
2013
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of the original 1st ed. 1991
Number of pages
343
Condition
New
SKU
V9781461367857
ISBN
9781461367857
Paperback
Condition: New

€ 67.75

Paperback. High definition video requires substantial compression in order to be transmitted or stored economically. This volume presents VLSI design and chip implementation for high definition H.264/AVC video encoding using a state-of-the-art video application. Num Pages: 187 pages, 25 black & white tables, biography. BIC Classification: TJFC; UGC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 10. Weight in Grams: 297.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
187
Condition
New
SKU
V9781489983824
ISBN
9781489983824
Paperback
Condition: New

€ 149.91

Hardback. High definition video requires substantial compression in order to be transmitted or stored economically. This volume presents VLSI design and chip implementation for high definition H.264/AVC video encoding using a state-of-the-art video application. Num Pages: 176 pages, 25 black & white tables, biography. BIC Classification: TBD; TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 12. Weight in Grams: 990.
Format
Hardback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Number of pages
176
Condition
New
SKU
V9781441909589
ISBN
9781441909589
Hardback
Condition: New

€ 131.27

Subscribe to our newsletter

News on special offers, signed editions & more!