×


 x 

Shopping cart

Electronics & communications engineering

Results 3461 - 3480 of 5951

Electronics & communications engineering

Hardback. This book proposes systemic design methodologies applied to electrical energy systems, in particular integrated optimal design with modeling and optimization methods and tools. It is made up of six chapters dedicated to integrated optimal design. Editor(s): Roboam, Xavier. Num Pages: 308 pages, Illustrations. BIC Classification: TJ. Category: (P) Professional & Vocational. Dimension: 239 x 166 x 23. Weight in Grams: 622.
Format
Hardback
Publication date
2012
Publisher
ISTE Ltd and John Wiley & Sons Inc United Kingdom
Edition
1st Edition
Number of pages
320
Condition
New
SKU
V9781848213890
ISBN
9781848213890
Hardback
Condition: New

€ 172.63

Hardcover. Editor(s): McIntire, Robert. Num Pages: 442 pages, tables & charts. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 262 x 185 x 36. Weight in Grams: 1106.
Format
Hardback
Publication date
2009
Publisher
Nova Science Publishers Inc United States
Number of pages
442
Condition
New
SKU
V9781606926604
ISBN
9781606926604
Hardback
Condition: New

€ 205.04
€ 139.42

Paperback. This book presents the theory, design methodology and fresh applications of integrated circuits for analog signal processing. It covers a wide variety of active devices, active elements and amplifiers, working in voltage mode, current mode and mixed mode. Editor(s): Tlelo-Cuautle, Esteban. Num Pages: 332 pages, 32 black & white tables, biography. BIC Classification: TJFC; TTBM. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 18. Weight in Grams: 510.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
332
Condition
New
SKU
V9781489994578
ISBN
9781489994578
Paperback
Condition: New

€ 164.16

Hardcover.
Format
Hardback
Publication date
1979
Publisher
James Clarke & Co Ltd United Kingdom
Number of pages
136
Condition
New
SKU
V9780718823436
ISBN
9780718823436
Hardback
Condition: New

€ 30.01

Hardcover. Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this booka s microelectronic package design--for--reliability guidelines and approaches essential for achieving their life--cycle, cost--effectiveness, and on--time delivery goals. Num Pages: 464 pages, bibliography. BIC Classification: TGPR; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 238 x 163 x 31. Weight in Grams: 840.
Format
Hardback
Publication date
1994
Publisher
John Wiley and Sons Ltd United States
Number of pages
464
Condition
New
SKU
V9780471594468
ISBN
9780471594468
Hardback
Condition: New

€ 211.67

Paperback. Num Pages: 300 pages, 75 black & white illustrations, biography. BIC Classification: TBD; TJFC; TJFD. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 17. Weight in Grams: 459.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2007
Number of pages
300
Condition
New
SKU
V9781441939234
ISBN
9781441939234
Paperback
Condition: New

€ 154.33

Hardback. Reviewing the various IC packaging, assembly, and interconnection technologies, this reference provides an overview of the materials and the processes, as well as the trends and options that encompass electronic manufacturing. It discusses the various packaging approaches, assembly options, and essential manufacturing technologies. Series: Springer Series in Advanced Microelectronics. Num Pages: 300 pages, 75 black & white illustrations, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 19. Weight in Grams: 636.
Format
Hardback
Publication date
2007
Publisher
Springer-Verlag New York Inc. United States
Number of pages
300
Condition
New
SKU
V9780387281537
ISBN
9780387281537
Hardback
Condition: New

€ 128.55

Hardcover. Editor(s): Gyvez, Jose Pineda de; Pradham, Dhiraj. Num Pages: 332 pages, references. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 256 x 184 x 22. Weight in Grams: 832.
Format
Hardback
Publication date
1998
Publisher
I.E.E.E.Press United States
Edition
1st Edition
Number of pages
332
Condition
New
SKU
V9780780334472
ISBN
9780780334472
Hardback
Condition: New

€ 264.23

Hardcover. The construction and failure analysis of highly integrated semiconductor components has gained in significance with the explosive growth in the semiconductor industry. Once a subordinate laboratory task, semiconductor failure analysis has now become a discipline in its own right. Series: Quality and Reliability Engineering Series. Num Pages: 190 pages, index. BIC Classification: TJFC; TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate; (XV) Technical / Manuals. Dimension: 246 x 161 x 16. Weight in Grams: 432.
Format
Hardback
Publication date
1998
Publisher
John Wiley and Sons Ltd United Kingdom
Edition
1st Edition
Number of pages
190
Condition
New
SKU
V9780471974017
ISBN
9780471974017
Hardback
Condition: New

€ 234.58

Hardback. Num Pages: 416 pages. BIC Classification: THK; TJFC. Category: (P) Professional & Vocational. Dimension: 244 x 170. .
Publisher
John Wiley & Sons Inc United States
Number of pages
416
Format
Hardback
Publication date
2019
Condition
New
SKU
V9781119966340
ISBN
9781119966340
Hardback
Condition: New

€ 121.93

Paperback. Series: Tutorial Guides in Electronic Engineering. BIC Classification: TJFC. Dimension: 246 x 189. Weight in Grams: 400.
Format
Paperback
Publication date
1990
Publisher
Springer US
Condition
New
SKU
V9780412342202
ISBN
9780412342202
Paperback
Condition: New

€ 63.83

Hardback. Spot defects are random phenomena present in every fabrication line. As technological processes mature towards submicron features, the effect of these defects on the functional and parametric behavior of the IC becomes crucial. This title reviews the importance of a defect-sensitivity analysis in contemporary VLSI design procedures. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 167 pages, 48 black & white illustrations, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 12. Weight in Grams: 1000.
Format
Hardback
Publication date
1992
Publisher
Kluwer Academic Publishers United States
Number of pages
167
Condition
New
SKU
V9780792393061
ISBN
9780792393061
Hardback
Condition: New

€ 125.99

Paperback. Constitutes the refereed proceedings of the 20th International Conference on Integrated Circuit and System Design, PATMOS 2010, held in Grenoble, France, in September 2010. Editor(s): Leuken, Rene van; Sicard, Gilles. Series: Lecture Notes in Computer Science / Theoretical Computer Science and General Issues. Num Pages: 260 pages, 77 black & white illustrations, 53 colour illustrations, biography. BIC Classification: TJFC; UKN; UYD. Category: (P) Professional & Vocational. Dimension: 236 x 155 x 15. Weight in Grams: 431.
Format
Paperback
Publication date
2011
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Number of pages
260
Condition
New
SKU
V9783642177514
ISBN
9783642177514
Paperback
Condition: New

€ 67.05

Paperback. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 210 pages, biography. BIC Classification: THR; TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 12. Weight in Grams: 355.
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of the original 1st ed. 1997
Number of pages
210
Condition
New
SKU
V9781461377870
ISBN
9781461377870
Paperback
Condition: New

€ 183.94

Paperback. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 501 pages, biography. BIC Classification: THR; TJFC; TTBM. Category: (P) Professional & Vocational. Dimension: 240 x 160 x 28. Weight in Grams: 864.
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of the original 1st ed. 1994
Number of pages
501
Condition
New
SKU
V9781461361862
ISBN
9781461361862
Paperback
Condition: New

€ 66.78

Hardcover. This is the only book currently available that covers this subject. The authors piece together information from diverse areas which is essential to understand integrated and integrated active antennas. Emphasis is placed on active antennas and power combining applications, consolidating the work from numerous researchers. Series: Wiley Series in Microwave and Optical Engineering. Num Pages: 368 pages, Illustrations. BIC Classification: TJFN; TJKR. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 243 x 166 x 26. Weight in Grams: 682.
Format
Hardback
Publication date
1996
Publisher
John Wiley and Sons Ltd United States
Edition
1st Edition
Number of pages
368
Condition
New
SKU
V9780471049845
ISBN
9780471049845
Hardback
Condition: New

€ 245.40

Hardcover. A modern presentation of integral methods in low-frequency electromagnetics, a timely area of research with applications in electrical engineering and magnetotellurics Provides an excellent introduction to key aspects of the class of integral methods in engineering areas. Presents practical model problems based on the author's own codes. Num Pages: 388 pages, Illustrations. BIC Classification: PHK; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 243 x 163 x 25. Weight in Grams: 686.
Format
Hardback
Publication date
2009
Publisher
John Wiley and Sons Ltd United Kingdom
Edition
1st Edition
Number of pages
388
Condition
New
SKU
V9780470195505
ISBN
9780470195505
Hardback
Condition: New

€ 145.45

Hardcover. With the widespread use of EHV equipment in winter environments, winter flashovers at air temperature close to melting point have become a critical design constraint. Series: IEEE Press Series on Power Engineering. Num Pages: 706 pages, Illustrations. BIC Classification: THX; TJFD. Category: (P) Professional & Vocational. Dimension: 240 x 159 x 36. Weight in Grams: 1076.
Format
Hardback
Publication date
2009
Publisher
John Wiley and Sons Ltd United Kingdom
Edition
1st Edition
Number of pages
680
Condition
New
SKU
V9780470282342
ISBN
9780470282342
Hardback
Condition: New

€ 212.93

Hardcover. A comprehensive and "state-of-the-art" coverage of the design and fabrication of IGBT. * All-in-one resource* Explains the fundamentals of MOS and bipolar physics. * Covers IGBT operation, device and process design, power modules, and new IGBT structures. . Num Pages: 648 pages, index. BIC Classification: TJFD5. Category: (P) Professional & Vocational. Dimension: 244 x 165 x 44. Weight in Grams: 1140.
Format
Hardback
Publication date
2003
Publisher
John Wiley & Sons Inc United States
Edition
1st Edition
Number of pages
648
Condition
New
SKU
V9780471238454
ISBN
9780471238454
Hardback
Condition: New

€ 219.03

Paperback. Num Pages: 240 pages, biography. BIC Classification: TJFM. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 12. Weight in Grams: 370.
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of the original 1st ed. 1988
Number of pages
240
Condition
New
SKU
V9781468463026
ISBN
9781468463026
Paperback
Condition: New

€ 121.81

Subscribe to our newsletter

News on special offers, signed editions & more!