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Electronics & communications engineering
Results 6681 - 6700 of 11682
Electronics & communications engineering
Hardcover. Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this booka s microelectronic package design--for--reliability guidelines and approaches essential for achieving their life--cycle, cost--effectiveness, and on--time delivery goals. Num Pages: 464 pages, bibliography. BIC Classification: TGPR; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 238 x 163 x 31. Weight in Grams: 840.
- Format
- Hardback
- Publication date
- 1994
- Publisher
- John Wiley and Sons Ltd United States
- Number of pages
- 464
- Condition
- New
- SKU
- V9780471594468
- ISBN
- 9780471594468
Hardback
Condition: New
€ 213.33
€ 213.33
Paperback. Num Pages: 300 pages, 75 black & white illustrations, biography. BIC Classification: TBD; TJFC; TJFD. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 17. Weight in Grams: 459.
- Format
- Paperback
- Publication date
- 2010
- Publisher
- Springer-Verlag New York Inc. United States
- Edition
- 1st ed. Softcover of orig. ed. 2007
- Number of pages
- 300
- Condition
- New
- SKU
- V9781441939234
- ISBN
- 9781441939234
Paperback
Condition: New
€ 161.18
€ 161.18
Hardback. Reviewing the various IC packaging, assembly, and interconnection technologies, this reference provides an overview of the materials and the processes, as well as the trends and options that encompass electronic manufacturing. It discusses the various packaging approaches, assembly options, and essential manufacturing technologies. Series: Springer Series in Advanced Microelectronics. Num Pages: 300 pages, 75 black & white illustrations, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 19. Weight in Grams: 636.
- Format
- Hardback
- Publication date
- 2007
- Publisher
- Springer-Verlag New York Inc. United States
- Number of pages
- 300
- Condition
- New
- SKU
- V9780387281537
- ISBN
- 9780387281537
Hardback
Condition: New
€ 134.00
€ 134.00
Hardcover. Editor(s): Gyvez, Jose Pineda de; Pradham, Dhiraj. Num Pages: 332 pages, references. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 256 x 184 x 22. Weight in Grams: 832.
- Format
- Hardback
- Publication date
- 1998
- Publisher
- I.E.E.E.Press United States
- Edition
- 1st Edition
- Number of pages
- 332
- Condition
- New
- SKU
- V9780780334472
- ISBN
- 9780780334472
Hardback
Condition: New
€ 268.13
€ 268.13
Hardcover. The construction and failure analysis of highly integrated semiconductor components has gained in significance with the explosive growth in the semiconductor industry. Once a subordinate laboratory task, semiconductor failure analysis has now become a discipline in its own right. Series: Quality and Reliability Engineering Series. Num Pages: 190 pages, index. BIC Classification: TJFC; TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate; (XV) Technical / Manuals. Dimension: 246 x 161 x 16. Weight in Grams: 432.
- Format
- Hardback
- Publication date
- 1998
- Publisher
- John Wiley and Sons Ltd United Kingdom
- Edition
- 1st Edition
- Number of pages
- 190
- Condition
- New
- SKU
- V9780471974017
- ISBN
- 9780471974017
Hardback
Condition: New
€ 241.37
€ 241.37
Hardback. Num Pages: 416 pages. BIC Classification: THK; TJFC. Category: (P) Professional & Vocational. Dimension: 244 x 170. .
- Publisher
- John Wiley & Sons Inc United States
- Number of pages
- 416
- Format
- Hardback
- Publication date
- 2019
- Condition
- New
- SKU
- V9781119966340
- ISBN
- 9781119966340
Hardback
Condition: New
€ 125.79
€ 125.79
Paperback. Series: Tutorial Guides in Electronic Engineering. BIC Classification: TJFC. Dimension: 246 x 189. Weight in Grams: 400.
- Format
- Paperback
- Publication date
- 1990
- Publisher
- Springer US
- Condition
- New
- SKU
- V9780412342202
- ISBN
- 9780412342202
Paperback
Condition: New
€ 66.61
€ 66.61
Hardback. Spot defects are random phenomena present in every fabrication line. As technological processes mature towards submicron features, the effect of these defects on the functional and parametric behavior of the IC becomes crucial. This title reviews the importance of a defect-sensitivity analysis in contemporary VLSI design procedures. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 167 pages, 48 black & white illustrations, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 12. Weight in Grams: 1000.
- Format
- Hardback
- Publication date
- 1992
- Publisher
- Kluwer Academic Publishers United States
- Number of pages
- 167
- Condition
- New
- SKU
- V9780792393061
- ISBN
- 9780792393061
Hardback
Condition: New
€ 131.39
€ 131.39
Hardback. Integrated Circuit Authentication Num Pages: 238 pages, 55 black & white illustrations, 65 colour illustrations, 47 black & white tables, biograp. BIC Classification: TJFC; URJ; UYF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 18. Weight in Grams: 537.
- Format
- Hardback
- Publication date
- 2013
- Publisher
- Springer International Publishing AG Switzerland
- Number of pages
- 238
- Condition
- New
- SKU
- V9783319008158
- ISBN
- 9783319008158
Hardback
Condition: New
€ 150.74
€ 150.74
Paperback. Constitutes the refereed post-conference proceedings of 18th International Workshop on Power and Timing Modeling, Optimization and Simulation, PATMOS 2008, featuring Integrated Circuit and System Design, held in Lisbon, Portugal. This book features sections on low-leakage and sub threshold circuits, and low-power methods and models. Series: Lecture Notes in Computer Science / Theoretical Computer Science and General Issues. Num Pages: 475 pages, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 28. Weight in Grams: 730.
- Format
- Paperback
- Publication date
- 2009
- Publisher
- Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
- Number of pages
- 475
- Condition
- New
- SKU
- V9783540959472
- ISBN
- 9783540959472
Paperback
Condition: New
€ 68.79
€ 68.79
Paperback. Constitutes the proceedings of the 17th International Workshop on Power and Timing Modeling, Optimization and Simulation, PATMOS 2007, held in Gothenburg, Sweden, in September 2007. This work contains papers organized in topical sections on high-level design, low power design techniques, low power analog circuits and low power applications. Series: Lecture Notes in Computer Science / Theoretical Computer Science and General Issues. Num Pages: 600 pages, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 30. Weight in Grams: 908.
- Format
- Paperback
- Publication date
- 2007
- Publisher
- Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
- Number of pages
- 600
- Condition
- New
- SKU
- V9783540744412
- ISBN
- 9783540744412
Paperback
Condition: New
€ 69.95
€ 69.95
Hardback. Covers CMOS chemical microsensor systems. This book presents information on important issues related to the realization of chemical microsensors in CMOS technology. It also presents the fundamentals of chemical sensing. Series: Microtechnology and MEMS. Num Pages: 230 pages, 120 black & white illustrations, 5 colour illustrations, biography. BIC Classification: PDN; PH; PNF; TBN; TDCK; TJFD. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 15. Weight in Grams: 570.
- Format
- Hardback
- Publication date
- 2005
- Publisher
- Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
- Number of pages
- 230
- Condition
- New
- SKU
- V9783540237822
- ISBN
- 9783540237822
Hardback
Condition: New
€ 194.85
€ 194.85
Paperback. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 210 pages, biography. BIC Classification: THR; TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 12. Weight in Grams: 355.
- Format
- Paperback
- Publication date
- 2012
- Publisher
- Springer-Verlag New York Inc. United States
- Edition
- Softcover reprint of the original 1st ed. 1997
- Number of pages
- 210
- Condition
- New
- SKU
- V9781461377870
- ISBN
- 9781461377870
Paperback
Condition: New
€ 193.47
€ 193.47
Paperback. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 501 pages, biography. BIC Classification: THR; TJFC; TTBM. Category: (P) Professional & Vocational. Dimension: 240 x 160 x 28. Weight in Grams: 864.
- Format
- Paperback
- Publication date
- 2012
- Publisher
- Springer-Verlag New York Inc. United States
- Edition
- Softcover reprint of the original 1st ed. 1994
- Number of pages
- 501
- Condition
- New
- SKU
- V9781461361862
- ISBN
- 9781461361862
Paperback
Condition: New
€ 69.67
€ 69.67
Hardcover. This is the only book currently available that covers this subject. The authors piece together information from diverse areas which is essential to understand integrated and integrated active antennas. Emphasis is placed on active antennas and power combining applications, consolidating the work from numerous researchers. Series: Wiley Series in Microwave and Optical Engineering. Num Pages: 368 pages, Illustrations. BIC Classification: TJFN; TJKR. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 243 x 166 x 26. Weight in Grams: 682.
- Format
- Hardback
- Publication date
- 1996
- Publisher
- John Wiley and Sons Ltd United States
- Edition
- 1st Edition
- Number of pages
- 368
- Condition
- New
- SKU
- V9780471049845
- ISBN
- 9780471049845
Hardback
Condition: New
€ 249.01
€ 249.01
Hardback. Describes various concepts and design techniques that can be used for 60GHz phased array systems. This title studies general trends and challenges in low-cost high data-rate 60GHz wireless system. It analyzes the system requirements of phase shifters, and compares different phased array architectures. Series: Analog Circuits and Signal Processing. Num Pages: 128 pages, biography. BIC Classification: TJFC; TJFD5; TJFN. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 9. Weight in Grams: 361.
- Format
- Hardback
- Publication date
- 2011
- Publisher
- Springer Netherlands
- Number of pages
- 128
- Condition
- New
- SKU
- V9789400706613
- ISBN
- 9789400706613
Hardback
Condition: New
€ 185.31
€ 185.31
Hardcover. A modern presentation of integral methods in low-frequency electromagnetics, a timely area of research with applications in electrical engineering and magnetotellurics Provides an excellent introduction to key aspects of the class of integral methods in engineering areas. Presents practical model problems based on the author's own codes. Num Pages: 388 pages, Illustrations. BIC Classification: PHK; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 243 x 163 x 25. Weight in Grams: 686.
- Format
- Hardback
- Publication date
- 2009
- Publisher
- John Wiley and Sons Ltd United Kingdom
- Edition
- 1st Edition
- Number of pages
- 388
- Condition
- New
- SKU
- V9780470195505
- ISBN
- 9780470195505
Hardback
Condition: New
€ 154.20
€ 154.20
Paperback. This volume examines ways of measuring the perceived quality of transmitted speech. It covers WB-PESQ, or wideband-perceptual speech evaluation, as well as the new diagnostic-instrumental method (DIAL), which includes perceptual and cognitive elements. Series: T-Labs Series in Telecommunication Services. Num Pages: 268 pages, biography. BIC Classification: TJK; TTA; UYS. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 14. Weight in Grams: 415.
- Format
- Paperback
- Publication date
- 2013
- Publisher
- Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
- Number of pages
- 268
- Condition
- New
- SKU
- V9783642268045
- ISBN
- 9783642268045
Paperback
Condition: New
€ 194.05
€ 194.05
Hardback. This volume examines ways of measuring the perceived quality of transmitted speech. It covers WB-PESQ, or wideband-perceptual speech evaluation, as well as the new diagnostic-instrumental method (DIAL), which includes perceptual and cognitive elements. Series: T-Labs Series in Telecommunication Services. Num Pages: 268 pages, biography. BIC Classification: PBW; TJK; UYS; UYZ. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 15. Weight in Grams: 553.
- Format
- Hardback
- Publication date
- 2011
- Publisher
- Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
- Number of pages
- 268
- Condition
- New
- SKU
- V9783642184628
- ISBN
- 9783642184628
Hardback
Condition: New
€ 194.82
€ 194.82
Hardcover. With the widespread use of EHV equipment in winter environments, winter flashovers at air temperature close to melting point have become a critical design constraint. Series: IEEE Press Series on Power Engineering. Num Pages: 706 pages, Illustrations. BIC Classification: THX; TJFD. Category: (P) Professional & Vocational. Dimension: 240 x 159 x 36. Weight in Grams: 1076.
- Format
- Hardback
- Publication date
- 2009
- Publisher
- John Wiley and Sons Ltd United Kingdom
- Edition
- 1st Edition
- Number of pages
- 680
- Condition
- New
- SKU
- V9780470282342
- ISBN
- 9780470282342
Hardback
Condition: New
€ 214.61
€ 214.61