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Electronics & communications engineering
Results 1661 - 1680 of 2135
Electronics & communications engineering
Hardcover. Geared to the usersa needs, this work provides comprehensive coverage of the main techniques and methods necessary to construct a self--tuning and self--adaptive system. Num Pages: 604 pages, Ill. BIC Classification: TGP; TJFM; UMZ. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 241 x 197 x 38. Weight in Grams: 1226.
- Format
- Hardback
- Publication date
- 1991
- Publisher
- John Wiley and Sons Ltd United Kingdom
- Edition
- 1st Edition
- Number of pages
- 604
- Condition
- New
- SKU
- V9780471928836
- ISBN
- 9780471928836
Hardback
Condition: New
€ 521.29
€ 521.29
Hardcover. Fault detection has become increasingly difficult as integrated circuits become more and more complex. Photon Emission Microscopy (PEM) is a physical failure analysis technique which locates and identifies faults in integrated circuits. Num Pages: 288 pages, Illustrations. BIC Classification: TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 232 x 160 x 20. Weight in Grams: 534.
- Format
- Hardback
- Publication date
- 2000
- Publisher
- John Wiley and Sons Ltd United Kingdom
- Edition
- 1st Edition
- Number of pages
- 288
- Condition
- New
- SKU
- V9780471492405
- ISBN
- 9780471492405
Hardback
Condition: New
€ 248.65
€ 248.65
Paperback. This introductory text presents well-balanced coverage of semiconductor physics and device operation, showing how devices are optimized for applications. Topics such as bandructure, effective masses, holes, doping, carrier transport and lifetimes are all discussed. Num Pages: 576 pages, Ill. BIC Classification: TJFD5; TJKR. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 195 x 30. Weight in Grams: 964.
- Format
- Paperback
- Publication date
- 2000
- Publisher
- John Wiley and Sons Ltd United States
- Edition
- 1st Edition
- Number of pages
- 576
- Condition
- New
- SKU
- V9780471362456
- ISBN
- 9780471362456
Paperback
Condition: New
€ 287.89
€ 287.89
Hardback. This volume offers a new approach to teaching the fundamentals of semiconductor components based on the use of the accompanying process and device simulation software. Users are encouraged to augment their understanding by undertaking simulations and creating their own devices. Num Pages: 346 pages, Illustrations. BIC Classification: PHFC; TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 250 x 174 x 25. Weight in Grams: 744.
- Format
- Hardback
- Publication date
- 1999
- Publisher
- John Wiley & Sons Inc United Kingdom
- Edition
- 1st Edition
- Number of pages
- 346
- Condition
- New
- SKU
- V9780471988540
- ISBN
- 9780471988540
Hardback
Condition: New
€ 165.66
€ 165.66
Hardcover. * Covers all key semiconductor devices with up-to-date information and easy-to-understand descriptions. Each chapter is presented in a logical manner enabling students to learn all important devices from a single source. * Covers historical developments of devices and technology in the last 100 years. Num Pages: 592 pages, black & white tables, figures. BIC Classification: TJ. Category: (P) Professional & Vocational. Dimension: 261 x 207 x 25. Weight in Grams: 1158.
- Format
- Hardback
- Publication date
- 2016
- Publisher
- John Wiley & Sons Inc
- Edition
- 3rd Edition
- Condition
- New
- SKU
- V9780470537947
- ISBN
- 9780470537947
Hardback
Condition: New
€ 329.65
€ 329.65
Paperback. .
- Publisher
- Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
- Number of pages
- 408
- Format
- Paperback
- Publication date
- 2011
- Edition
- Softcover reprint of the original 1st ed. 1987
- Condition
- New
- SKU
- V9783642729690
- ISBN
- 9783642729690
Paperback
Condition: New
€ 130.24€ 20.56
€ 130.24
€ 20.56
Hardcover. This reference book provides a fully integrated novel approach to the development of high-power, single-transverse mode, edge-emitting diode lasers by addressing the complementary topics of device engineering, reliability engineering and device diagnostics in the same book, and thus closes the gap in the current book literature. Num Pages: 522 pages, Illustrations. BIC Classification: TJFD5; TTBL. Category: (P) Professional & Vocational. Dimension: 236 x 161 x 30. Weight in Grams: 780.
- Format
- Hardback
- Publication date
- 2013
- Publisher
- John Wiley & Sons Inc United States
- Edition
- 1st Edition
- Number of pages
- 522
- Condition
- New
- SKU
- V9781119990338
- ISBN
- 9781119990338
Hardback
Condition: New
€ 123.44
€ 123.44
Hardcover. This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Num Pages: 800 pages, illustrations. BIC Classification: TJFD5. Category: (P) Professional & Vocational. Dimension: 238 x 164 x 42. Weight in Grams: 1199.
- Format
- Hardback
- Publication date
- 2006
- Publisher
- John Wiley and Sons Ltd United Kingdom
- Edition
- 3rd Edition
- Number of pages
- 800
- Condition
- New
- SKU
- V9780471739067
- ISBN
- 9780471739067
Hardback
Condition: New
€ 232.19
€ 232.19
Hardcover. Provides the reader with memory fundamentals as well as directions for future research. Examines memory history, current memory technology and offers a glimpse at the future of memories. Num Pages: 822 pages, index. BIC Classification: PHFC; TJFC; UKS. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 257 x 198 x 50. Weight in Grams: 1800.
- Format
- Hardback
- Publication date
- 1996
- Publisher
- John Wiley and Sons Ltd United Kingdom
- Edition
- 2nd Edition
- Number of pages
- 822
- Condition
- New
- SKU
- V9780471942955
- ISBN
- 9780471942955
Hardback
Condition: New
€ 767.59
€ 767.59
Hardcover. Editor(s): Sachs, Kenneth G. Num Pages: 399 pages, tables & charts. BIC Classification: TJFD5. Category: (P) Professional & Vocational. Dimension: 263 x 187 x 32. Weight in Grams: 1090.
- Format
- Hardback
- Publication date
- 2007
- Publisher
- Nova Science Publishers Inc United States
- Number of pages
- 399
- Condition
- New
- SKU
- V9781600215797
- ISBN
- 9781600215797
Hardback
Condition: New
€ 278.26€ 189.69
€ 278.26
€ 189.69
Hardcover. An interdisciplinary work offering an introduction to the basic principles and operational characteristics of semiconductor sensors. Describes sensor technology, stressing bulk and surface micromachining. Considers a sensor group related to a special physical, chemical or biological input signal. The final chapter deals with integrated sensors. Editor(s): Sze, Simon M. Num Pages: 576 pages, Illustrations. BIC Classification: PHFC; TJFC; TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 237 x 167 x 35. Weight in Grams: 962.
- Format
- Hardback
- Publication date
- 1994
- Publisher
- John Wiley and Sons Ltd United States
- Edition
- 1st Edition
- Number of pages
- 576
- Condition
- New
- SKU
- V9780471546092
- ISBN
- 9780471546092
Hardback
Condition: New
€ 242.32
€ 242.32
Hardback. Key advances in Semiconductor Terahertz (THz) Technology now promises important new applications enabling scientists and engineers to overcome the challenges of accessing the so-called "terahertz gap". Series: Wiley - IEEE. Num Pages: 408 pages. BIC Classification: TJFD5. Category: (P) Professional & Vocational. Dimension: 253 x 176 x 26. Weight in Grams: 798.
- Format
- Hardback
- Publication date
- 2015
- Publisher
- John Wiley & Sons Inc
- Edition
- 1st Edition
- Condition
- New
- SKU
- V9781118920428
- ISBN
- 9781118920428
Hardback
Condition: New
€ 121.21
€ 121.21
Hardcover. Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field. Series: ECS Series of Texts and Monographs. Num Pages: 320 pages, illustrations. BIC Classification: PHFC; PNRH; TGMT; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 243 x 165 x 23. Weight in Grams: 598.
- Format
- Hardback
- Publication date
- 1998
- Publisher
- John Wiley & Sons Inc United States
- Edition
- 1st Edition
- Number of pages
- 320
- Condition
- New
- SKU
- V9780471574811
- ISBN
- 9780471574811
Hardback
Condition: New
€ 234.73
€ 234.73
Hardcover. Many electronic applications present in our everyday life would not be possible without sensors. Without their ability to measure or control physical quantities, many electronic devices would remain as simple laboratory curiosities. This book is unique in its treatment of both signal conditioning and sensors. Num Pages: 608 pages, index. BIC Classification: THR; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 240 x 162 x 38. Weight in Grams: 1036.
- Format
- Hardback
- Publication date
- 2000
- Publisher
- John Wiley & Sons Inc United States
- Edition
- 2nd Edition
- Number of pages
- 608
- Condition
- New
- SKU
- V9780471332329
- ISBN
- 9780471332329
Hardback
Condition: New
€ 234.73
€ 234.73
Hardback. Save time & resources with this comprehensive guide to automation configuration for the value-added IP services of the future. Series: Wiley Series on Communications Networking and Distributed Systems. Num Pages: 346 pages, Illustrations. BIC Classification: TJ. Category: (P) Professional & Vocational. Dimension: 256 x 176 x 24. Weight in Grams: 750.
- Format
- Hardback
- Publication date
- 2008
- Publisher
- John Wiley & Sons Inc United States
- Number of pages
- 346
- Condition
- New
- SKU
- V9780470018293
- ISBN
- 9780470018293
Hardback
Condition: New
€ 137.72
€ 137.72
Hardcover. A Local Area Network (LAN) is a network usually within a single office or building that links desktop computers with each other and with peripherals such as servers and printers. The interconnect is the electrical and functional association of two different services. This work concerns these areas. Editor(s): Hu, Y. Fun; Maral, Gerard; Ferro, Erina. Num Pages: 272 pages, Ill. BIC Classification: TJK; UT. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 244 x 173 x 20. Weight in Grams: 586.
- Format
- Hardback
- Publication date
- 2002
- Publisher
- John Wiley and Sons Ltd United Kingdom
- Edition
- 1st Edition
- Number of pages
- 272
- Condition
- New
- SKU
- V9780471486695
- ISBN
- 9780471486695
Hardback
Condition: New
€ 271.43
€ 271.43
Hardcover. This book explains why applications running on cloud might not deliver the same service reliability, availability, latency and overall quality to end users as they do when the applications are running on traditional (non-virtualized, non-cloud) configurations, and explains what can be done to mitigate that risk. Num Pages: 344 pages, Illustrations. BIC Classification: TJK; UTC. Category: (P) Professional & Vocational. Dimension: 242 x 155 x 23. Weight in Grams: 588.
- Format
- Hardback
- Publication date
- 2014
- Publisher
- John Wiley & Sons Inc United States
- Number of pages
- 344
- Condition
- New
- Edition
- 1st Edition
- SKU
- V9781118763292
- ISBN
- 9781118763292
Hardback
Condition: New
€ 98.02
€ 98.02
Hardback. Series: Systems & Control: Foundations and Applications. Num Pages: 630 pages, 151 black & white illustrations, 18 colour illustrations, 3 black & white tables, biograp. BIC Classification: GPFC; PBKQ; PBWR; TJFM; TJFM1. Category: (P) Professional & Vocational. Dimension: 167 x 246 x 30. Weight in Grams: 1002.
- Format
- Hardback
- Publication date
- 2015
- Publisher
- Birkhäuser
- Edition
- 2nd ed. 2015
- Condition
- New
- SKU
- V9783319179322
- ISBN
- 9783319179322
Hardback
Condition: New
€ 177.61€ 168.50
€ 177.61
€ 168.50
Hardback. Series: Electromagnetics and Radar. Num Pages: 222 pages, black & white illustrations, black & white tables, figures. BIC Classification: TJKR. Category: (UP) Postgraduate, Research & Scholarly. Dimension: 242 x 157 x 18. Weight in Grams: 494.
- Publisher
- SciTech Publishing Inc
- Format
- Hardback
- Publication date
- 2014
- Edition
- 5th edition
- Condition
- New
- SKU
- V9781891121975
- ISBN
- 9781891121975
Hardback
Condition: New
€ 92.65
€ 92.65
Hardcover. How to manage the most important part of a city's internal infrastructure--its sewer systems The operation and maintenance of modern sewer systems have not kept pace with technological revolutions everywhere--until now. Series: Wiley Series in Infrastructure Management and Design. Num Pages: 400 pages, Ill. BIC Classification: TJFM; TQSR. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 212 x 241 x 22. Weight in Grams: 642.
- Format
- Hardback
- Publication date
- 2000
- Publisher
- John Wiley and Sons Ltd United States
- Edition
- 1st Edition
- Number of pages
- 400
- Condition
- New
- SKU
- V9780471317999
- ISBN
- 9780471317999
Hardback
Condition: New
€ 177.76
€ 177.76