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M.R. Oliver - Chemical-Mechanical Planarization of Semiconductor Materials - 9783642077388 - V9783642077388
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Chemical-Mechanical Planarization of Semiconductor Materials

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Description for Chemical-Mechanical Planarization of Semiconductor Materials Paperback. Series: Springer Series in Materials Science. Num Pages: 439 pages, biography. BIC Classification: PNR; TDCK; TGMT; TGP; TJFD. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 22. Weight in Grams: 676.
Chemical Mechanical Planarization (CMP) has emerged in the last two decades and grown rapidly as a basic technology widely used in semiconduc­ tor device fabrication. As a semiconductor processing step, it was developed at IBM in the mid 1980s. From this beginning the technology has been widely adopted throughout the semiconductor industry. As basic CMP technology has been understood and accepted throughout the semiconductor industry, its uses in different parts of the semiconductor process have multiplied. This includes special steps for some special process­ ing flows, such as for DRAM technology. In addition, the availability of CMP technology has enabled ... Read more

Product Details

Format
Paperback
Publication date
2010
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Number of pages
439
Condition
New
Series
Springer Series in Materials Science
Number of Pages
428
Place of Publication
Berlin, Germany
ISBN
9783642077388
SKU
V9783642077388
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15

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